Device Integration Lead

• 2023 - Present

Senior Quantum Hardware Engineer

• 2022 - 2023

Quantum Device Engineer

• 2020 - 2022

Developing fabrication processes and CAD designs for Majorana qubits in the Qutech / Microsoft joint effort to build a topological quantum computer. Developing fabrication processes and CAD designs for Majorana qubits in the Qutech / Microsoft joint effort to build a topological quantum computer.

Technical Research Engineer

• 2019 - 2020

Engineer in Industrial Agreements for Training through Research (CIFRE)

• 2016 - 2019

I worked for 3 years with a tripartite collaboration between STMicroelectronics, CEA LETI, and IM2NP. It allowed me to get an internal view of industry work by working for one of the world’s largest semiconductor companies. I was also part of CEA-Leti a technology research institute that work in close collaboration with industrial partners, and an institute that gathers the expertise for research and education in materials, microelectronics and nanosciences. This project allowed me to work on the understanding of the mechanisms involved in the solid state reactions to form silicides and to perform metallurgical characterizations of alloyed contacts (Atom Probe Tomography, XRD, TEM, SEM…). I improved my scientific skills in nano devices fabrication, physical and chemical characterization, metallurgy, and diffusion theory. Show less

Projet de fin d'études - Final Project

• Feb 2015 - Jul 2015

Final engineering project - Electronic mobility study in III-V (InGaAs) bonded layer: Process engineering and fabrication in clean room (lithography, CVD, PVD, etching). Electrical characterizations on test structures (Hall effect, TLM). Physical characterizations (ellipsometry, profilometry, SEM). Final engineering project - Electronic mobility study in III-V (InGaAs) bonded layer: Process engineering and fabrication in clean room (lithography, CVD, PVD, etching). Electrical characterizations on test structures (Hall effect, TLM). Physical characterizations (ellipsometry, profilometry, SEM).

Stagiaire - Intern

• May 2014 - Aug 2014

Study of HPT-processed Vanadium’s microstructure and evaluation of its mechanical properties : samples manufacturing,characterisation with hardness tests, tensile tests and EBSD. Etude de la microstructure du vanadium et de ses propriétés mécaniques après une torsion à haute pression : réalisation des échantillons et caractérisation par essais de dureté, de traction, EBSD. Study of HPT-processed Vanadium’s microstructure and evaluation of its mechanical properties : samples manufacturing,characterisation with hardness tests, tensile tests and EBSD. Etude de la microstructure du vanadium et de ses propriétés mécaniques après une torsion à haute pression : réalisation des échantillons et caractérisation par essais de dureté, de traction, EBSD.

Stagiaire - Intern

• Jun 2013 - Aug 2013

Operator internship in clean room (shift work). Stage opérateur en environnement salle blanche. Travail sur le site de Crolles : transport des wafers, lancement des lots sur les machines et contrôle des équipements en chaîne de production. Travail posté. Operator internship in clean room (shift work). Stage opérateur en environnement salle blanche. Travail sur le site de Crolles : transport des wafers, lancement des lots sur les machines et contrôle des équipements en chaîne de production. Travail posté.