Experience

Inphi Corporation

• Computer Networking
• 1 - 100 Employee

• Sr Staff Validation Engineer

  • Nov 2012 - Present

  Performing post-silicon validation and characterization of optical transimpedance amplifiers and laser modulator drivers that run up to 32Gb/s. Performing post-silicon validation and characterization of optical transimpedance amplifiers and laser modulator drivers that run up to 32Gb/s.



Intel Corporation

• United States
• Semiconductor Manufacturing
• 700 & Above Employee

• Senior Product and Test Engineer

  • Jul 2011 - Nov 2012

  Fulcrum Microsystems has been acquired by Intel Corporation. Fulcrum is now the Switch and Router Division of Intel specializing in high speed routers/switch chips destined for high data volume applications. My position in Product and Test Engineering continues as with Fulcrum. Fulcrum Microsystems has been acquired by Intel Corporation. Fulcrum is now the Switch and Router Division of Intel specializing in high speed routers/switch chips destined for high data volume applications. My position in Product and Test Engineering continues as with Fulcrum.



Fulcrum Microsystems

• United States
• Semiconductor Manufacturing
• 1 - 100 Employee

• Senior Product and Test Engineer

  • Jun 2008 - Jul 2011

  Test development of next generation high speed Ethernet router chips, designed using asynchronous logic methodology. Test development of next generation high speed Ethernet router chips, designed using asynchronous logic methodology.



Inphi Corporation

• United States
• Semiconductor Manufacturing
• 100 - 200 Employee

• Senior Product Engineer

  • Apr 2007 - Jun 2008

  Product and test engineering for 10Gb transimpedance amplifiers (TIAs) used in fiber optic communciations systems. Product and test engineering for 10Gb transimpedance amplifiers (TIAs) used in fiber optic communciations systems.



Semtech

• United States
• Technology, Information and Internet
• 700 & Above Employee

• Senior Product and Process Engineer

  • Oct 2003 - Mar 2007

  Addressed yield issues with power management ICs. Worked in development of next-generation power BiCMOS IC processes with overseas foundries. Developed SPICE models for BiCMOS transistors and passive devices. Addressed yield issues with power management ICs. Worked in development of next-generation power BiCMOS IC processes with overseas foundries. Developed SPICE models for BiCMOS transistors and passive devices.



Vitesse Semiconductor is now Microsemi

• Semiconductor Manufacturing
• 1 - 100 Employee

• Senior Product and Process Yield Engineer

  • Mar 1992 - Oct 2003

  Process development and yield improvement work for Gallium Arsenide VLSI ICs. SPICE model development for ion-house GaAs MESFET technology. Design kit development including on-wafer HBT and passive component characterization to develop SPECTRE models for in-house Indium-phosphide HBT process. Process development and yield improvement work for Gallium Arsenide VLSI ICs. SPICE model development for ion-house GaAs MESFET technology. Design kit development including on-wafer HBT and passive component characterization to develop SPECTRE models for in-house Indium-phosphide HBT process.