Experience

Kulicke & Soffa

• Singapore
• Semiconductor Manufacturing
• 700 & Above Employee

• Staff Engr

  • Jun 2014 - Present



UTAC

• Semiconductor Manufacturing
• 700 & Above Employee

• Senior Wirebond Engineer

  • Aug 2003 - May 2014

  1.0 Involve in the development of copper application for SITEL & TELECHIP customer. 2.0 Special looping for Broadcom devices encountering wire sweep during Molding. 3.0 Wirebond equipment and packaging materials evauation/qualification 4.0 Plans and manages maintenance activities to maintain a high level of production service; Manages and motivates a team of Lead-technicians to achieve goals set-up by management; Plans work schedule of maintenance ; Sets measurable objectives to be achieved and made them happen; Responsible for the overall operation of Front Line Equipment utilization. Responsible for managing large work teams (up to 60 people). Show less



Kulicke & Soffa

• Singapore
• Semiconductor Manufacturing
• 700 & Above Employee

• Application & Process Engineer

  • Jul 1999 - Apr 2003

  Responsible for equipment and packaging materials buy-offs; Monitors competitors’ Performance and improvements; Recommends effective solutions, conducts Design of Experiments and Process Characterization of KNS-bonders in customer sites; Good Coordination with local and Singapore team members to ensure timely completion of Projects. ; Investigates and recommends solutions to resolve customer reliability issues; responsible for direct competitor product analysis. Establishes and maintains good Customer- K&S partnership; Provides training, customer engineering evaluations, experiments and yield productivity programs; Supports Sales operations and presents expert overview on machine field performance and breakdowns; Liased with software, mechanical and RND engineers regarding design problems in the field; Represents the company in promoting product/equipment for potential customers Show less



Philips Semiconductors Calamba

• Equipment Engineer

  • Aug 1998 - 1999

  1.0 Start-up LQFP, QFP, Matrix QFP products. 2.0 Evaluate materials such as Goldwire, capillary and leadframe to be use for new device. 2.0 Responsible for the qualification of all Front of Line Equipment in preparation for production run. 3.0 Responsible for the set-up and qualification of Advanced Assembly Line (AAL) and Snapcure oven. 1.0 Start-up LQFP, QFP, Matrix QFP products. 2.0 Evaluate materials such as Goldwire, capillary and leadframe to be use for new device. 2.0 Responsible for the qualification of all Front of Line Equipment in preparation for production run. 3.0 Responsible for the set-up and qualification of Advanced Assembly Line (AAL) and Snapcure oven.