Experience

Kinsus Interconnect Technology Corp.

• Taiwan
• Semiconductor Manufacturing
• 200 - 300 Employee

• Customer Quality Senior Manager

  • Jun 2022 - Present

  1. Customer quality case handle2. Internal quality improvement (IQC/IPQC/OQC/QS)3. Customer relationship mentain and business promotion 1. Customer quality case handle2. Internal quality improvement (IQC/IPQC/OQC/QS)3. Customer relationship mentain and business promotion



SPIL 矽品

• Taiwan
• Semiconductor Manufacturing
• 200 - 300 Employee

• Project Manager

  • Feb 2022 - Jun 2022

  1. Internal project 2.5D/3D package development2. Co-work with customer for 2.5D/3D package development3. 2.5D/3D new package engagement 4. Business analysis and define development strategy 1. Internal project 2.5D/3D package development2. Co-work with customer for 2.5D/3D package development3. 2.5D/3D new package engagement 4. Business analysis and define development strategy



台星科/Winstek Semiconductor Co., Ltd.

• Taiwan
• Semiconductor Manufacturing
• 1 - 100 Employee

• Project Manager

  • Jul 2019 - Jan 2022

  1. Project management and business promotion for flip chip package2. Package structure design and new package structure co-development3. Package selection / Assembly process design / Risk assessment.4. Establish new flip chip line system setup: RFQ / TRA / NPI / design rule / BOM / SPEC…etc. 1. Project management and business promotion for flip chip package2. Package structure design and new package structure co-development3. Package selection / Assembly process design / Risk assessment.4. Establish new flip chip line system setup: RFQ / TRA / NPI / design rule / BOM / SPEC…etc.



ASE Global

• Taiwan
• Semiconductor Manufacturing
• 700 & Above Employee

• Manager

  • Nov 2012 - Jun 2019

  Responsibilities: 1. Customer project handle 2. New package development 3. Business promotionExperience: 1. Cowork with customer and internal team for customer project handle and management2. Cowork with customer for new package development3. Cowork with internal team for yield and reliability performance improvement4. Customer engagement and business propotion Responsibilities: 1. Customer project handle 2. New package development 3. Business promotionExperience: 1. Cowork with customer and internal team for customer project handle and management2. Cowork with customer for new package development3. Cowork with internal team for yield and reliability performance improvement4. Customer engagement and business propotion



SPIL 矽品

• Taiwan
• Semiconductor Manufacturing
• 200 - 300 Employee

• Teconical manager

  • Nov 2011 - Nov 2012

  Responsibilities:1. New package development 2. New process development3. Customer engagementExperience: 1. Internal project for low cost package development2. Co-work with customer for low cost package development Responsibilities:1. New package development 2. New process development3. Customer engagementExperience: 1. Internal project for low cost package development2. Co-work with customer for low cost package development



TSMC

• Taiwan
• Semiconductor Manufacturing
• 700 & Above Employee

• Senior process integration engineer

  • Sep 2001 - Nov 2010

  Responsibilities:(I) Senior process integration engineer 1. Process Integration (0.25um / 0.15um / 0.13um / 80nm / 55nm Logic )2. Low yield analysis, Yield Improvement3. SPC / WAT data analysis, 4. Trouble shooting for WAT and low yield5. Conference call with customer (II) Senior process develop engineer1. Process development2. Yield improvement3. Data analysis4. Trouble shooting Responsibilities:(I) Senior process integration engineer 1. Process Integration (0.25um / 0.15um / 0.13um / 80nm / 55nm Logic )2. Low yield analysis, Yield Improvement3. SPC / WAT data analysis, 4. Trouble shooting for WAT and low yield5. Conference call with customer (II) Senior process develop engineer1. Process development2. Yield improvement3. Data analysis4. Trouble shooting



Winbond

• Taiwan
• Semiconductor Manufacturing
• 700 & Above Employee

• Process integration engineer

  • Mar 2001 - Sep 2002

  Responsibilities:1. Process Integration2. Low yield analysis, 3. Yield improvement Responsibilities:1. Process Integration2. Low yield analysis, 3. Yield improvement