Experience

Pragmatic

• United Kingdom
• Semiconductor Manufacturing
• 100 - 200 Employee

• Assembly Manager

  • Feb 2022 - Present



TT Electronics plc

• United Kingdom
• Appliances, Electrical, and Electronics Manufacturing
• 700 & Above Employee

• Senior Process Engineer

  • Aug 2020 - Feb 2022

• Production Engineering Manager

  • Oct 2017 - Aug 2020

• Production Manager

  • Jun 2017 - Oct 2017

• Production Engineer

  • Nov 2012 - Jun 2017

  I have gained my Lean Six Sigma Green Belt certification and have recently been Black Belt trained. I am involved in Continuous Improvement projects at Black Belt level. My day to day responsibilities include fine aluminium wire bond, gold wire bond, plasma cleaning, some electrical test, and general production support.



NXP Semiconductors

• Netherlands
• Semiconductor Manufacturing
• 700 & Above Employee

• Process Engineer

  • Oct 2010 - Nov 2012

  My responsibilities included sustaining work within the fab, SPC, lean manufacturing and yield based projects. I gained my Six Sigma Yellow Belt accreditation and undertook Green Belt training. I worked on continuous improvement projects at green belt level. My responsibilities included sustaining work within the fab, SPC, lean manufacturing and yield based projects. I gained my Six Sigma Yellow Belt accreditation and undertook Green Belt training. I worked on continuous improvement projects at green belt level.



Newcastle University

• United Kingdom
• Higher Education
• 700 & Above Employee

• PhD Student

  • Oct 2007 - Oct 2010

  Nanoscale Strain Characterisation in Modern Mocroelectronics. Throughout my time at Newcastle University, I have gained practical experience with several materials characterisation techniques including Raman Spectroscopy, Atomic Force Microscopy, Scanning Electron Microscopy, Electron Backscatter Diffraction and nanoindentation. The materials considered throughout this project include both blanket copper and deep sub-micron copper interconnects, strained Silicon/Silicon-Germanium and strained Silicon on insulator also both on blanket samples at the nano-scale. A large part of my project has involved pushing the limits of current techniques to the nano-scale and developing techniques to be suitable in an industrial setting. I have also gained experience of presenting to a range of audiences including undergraduate lab demonstrating, presenting to colleagues both within my group and within the wider research environment. Experience of presenting at an international conference has also been gained. I have completed several workshops on subjects such as MS Office, presentation skill, conferencing and networking, scientific writing, design of experiments and statistics. Show less



Atmel Corporation

• Semiconductor Manufacturing
• 700 & Above Employee

• Graduate Process Engineer

  • Sep 2006 - Oct 2007

  Atmel Graduate Scheme including rotations in Implant, Thin Films, Failure Analysis and Yield. Atmel Graduate Scheme including rotations in Implant, Thin Films, Failure Analysis and Yield.