Liana Jackson
Senior Advanced Packaging Manufacturing Engineer at American Semiconductor- Claim this Profile
Contact Information
us****@****om
(386) 825-5501
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Location
Boise, Idaho, United States, US
Skills
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Experience
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American Semiconductor
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United States
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Semiconductor Manufacturing
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1 - 100 Employee
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Senior Advanced Packaging Manufacturing Engineer
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Jun 2021 - Present
Boise, Idaho, United States
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Micron Technology
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United States
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Semiconductor Manufacturing
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700 & Above Employee
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Process Control Engineer
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Jan 2018 - Jun 2021
Boise, Idaho, United States
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Process Engineer
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Jan 2005 - Jan 2018
Boise, Idaho, United States
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Assembly Product Technician
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Jan 2003 - Dec 2004
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Equipment Maintenance Technician
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Apr 2001 - Dec 2002
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Education
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2001 - 2010
Boise State University
BSMSE, Materials Science & Engineering, Phyics, Mathematics, Biomaterials -
1999 - 2001
DeVry Institute of Technology
AASECT, Electronics and Computer Technology
Community
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