Experience

Taichung University of Education

• Higher Education
• 200 - 300 Employee

• 助理教授

  • Feb 2023 - Present



EMC (Elite Material Co., Ltd.)

• Taiwan
• Appliances, Electrical, and Electronics Manufacturing
• 1 - 100 Employee

• 產品經理

  • Mar 2021 - Feb 2023

  ▌Planning the system upgrade of material measurement — DK/DF testing fixtures passive intermodulation, thermal coefficient of dielectric constant, and frequency drift. ▌Roughness-detection software development for inner-layer single end or differential pair analysis. ▌Creating an AI database software for estimating the material formulas ▌Implementing a novel formula for mmWave and sub-THz applications, coordinating divisions for materials reforming. ▌Tutoring RF material knowledge for regular internal course training. Show less



Taiwan Union Technology

• Appliances, Electrical, and Electronics Manufacturing
• 1 - 100 Employee

• Project Manager

  • Nov 2017 - Sep 2020

  ▌Leading the material measurement — Enhancing the accuracy of test features for IPC standards. — Formulating S.O.P and testing kits of PIM, TCDK, and frequency drift, etc. ▌Improving advanced substrates design for high-speed digital and radio frequency system integration. — Could be simplified into PCB process, high reliability, low loss, low dispersion, and robust signal integrity ▌Collaborating with customers in the base station and UE for 4G, BT, Wi-Fi, and mmWave applications. — A design of 28 GHz and 6 channels AAU antenna system module includes PA and LNA front-end. Show less



Industrial Technology Research Institute (ITRI)(工業技術研究院, 工研院)

• Taiwan
• Research Services
• 700 & Above Employee

• Senior Engineer

  • Oct 2006 - Oct 2017

  ▌Antenna designs: — NFC and UHF RFID, MRI coil array, an implantable wireless energy transformation system, Wi-Fi in NB, embedded BT system in SiP module, 24 GHz duplexing system, 60 GHz antenna on glass substrate design, and mmWave UWB- planar antenna array. ▌RF device and packaging design — RF interconnect design of BGA and wire bonding, mmWave interconnection of SIW structure, and 60 GHz 18dB LNA design and relative measurements. ▌Antenna designs: — NFC and UHF RFID, MRI coil array, an implantable wireless energy transformation system, Wi-Fi in NB, embedded BT system in SiP module, 24 GHz duplexing system, 60 GHz antenna on glass substrate design, and mmWave UWB- planar antenna array. ▌RF device and packaging design — RF interconnect design of BGA and wire bonding, mmWave interconnection of SIW structure, and 60 GHz 18dB LNA design and relative measurements.