Leo Shen
SVP/GM, Mobile BU at Pixelworks- Claim this Profile
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English Full professional proficiency
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Chinese Native or bilingual proficiency
Topline Score
Bio
Experience
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Pixelworks
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Semiconductor Manufacturing
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100 - 200 Employee
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SVP/GM, Mobile BU
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Jul 2021 - Present
Manage product portfolio and P/L of Mobile Business Manage product portfolio and P/L of Mobile Business
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Qualcomm
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United States
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Telecommunications
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700 & Above Employee
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Sr. Director of Product Marketing, QCT
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Oct 2010 - Jul 2021
China product marketing head for Cellular Connectivity (4G/5G Modem/Tcvr/RFFE), Wireless Connectivity (Wifi, Bluetooth, NFC), Power Management (PMIC, SMB), Audio (Codec, Smart PA) and IOT (Industrial, Retail, Robotics, Drones, Camera, Smart cities and etc.) China product marketing head for Cellular Connectivity (4G/5G Modem/Tcvr/RFFE), Wireless Connectivity (Wifi, Bluetooth, NFC), Power Management (PMIC, SMB), Audio (Codec, Smart PA) and IOT (Industrial, Retail, Robotics, Drones, Camera, Smart cities and etc.)
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Qorvo, Inc.
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Semiconductor Manufacturing
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700 & Above Employee
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Gr. China Head of Product Marketing and BD, CPG
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Jul 2006 - Oct 2010
Gr. China (China+Taiwan) product marketing lead for cellular 2G/3G RF Front End components and modules (PA, Filter, Switch). Business development head for local OEM/ODMs, Platform partners, and Telco operators. Gr. China (China+Taiwan) product marketing lead for cellular 2G/3G RF Front End components and modules (PA, Filter, Switch). Business development head for local OEM/ODMs, Platform partners, and Telco operators.
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LSI, an Avago Technologies Company
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Semiconductor Manufacturing
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700 & Above Employee
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Sr. Account Manager, Mobility BU
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Jul 2004 - Jul 2006
China Sales for 2G/3G chipsets (Vision, HPU, X400 and etc) China Sales for 2G/3G chipsets (Vision, HPU, X400 and etc)
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NXP acquires Freescale Semiconductor
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United States
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Semiconductor Manufacturing
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700 & Above Employee
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FAE Manager, Wireless Mobile System Group
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Apr 2003 - Jul 2004
Regional customer engineering lead for i.250 cellular platforms and i.MX AP. Regional customer engineering lead for i.250 cellular platforms and i.MX AP.
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NXP Semiconductors
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Netherlands
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Semiconductor Manufacturing
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700 & Above Employee
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System Engineer, China Design Competence Center
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Mar 2000 - Apr 2003
Chipset solution developer and team leader for SySol2/3 platforms. Focus on system software (RTOS, Device drivers, Protocol stack, and Customer tools). Chipset solution developer and team leader for SySol2/3 platforms. Focus on system software (RTOS, Device drivers, Protocol stack, and Customer tools).
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Education
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Beihang University
MS, EE -
Shandong University
BS, EE