Lenard Engman
Sr. Design Engineer at Hypertronics Corp- Claim this Profile
Contact Information
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(386) 825-5501
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Location
Massachusetts, United States, US
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Experience
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Sr. Design Engineer
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FLIR Systems
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United States
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Appliances, Electrical, and Electronics Manufacturing
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700 & Above Employee
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Electronic Packaging Engineer
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Mar 2002 - Sep 2005
Packaging of electronics utilizing "Cold Plate" design and DIp Brazing process to create light weight enclosures for the IR cameras. Developed packaging of cameras within the Gimbel mounted to the underside of aircraft. Packaging of electronics utilizing "Cold Plate" design and DIp Brazing process to create light weight enclosures for the IR cameras. Developed packaging of cameras within the Gimbel mounted to the underside of aircraft.
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Education
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1966 - 1970
Rensselaer at Work
BSME, Advanced Electro-Mechanical Design
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