Lee Benson

專案主任 at Moxa
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Contact Information
us****@****om
(386) 825-5501
Location
Taipei–Keelung Metropolitan area, TW

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Experience

    • Business Consulting and Services
    • 1 - 100 Employee
    • 專案主任
      • Aug 2015 - Present
    • Computer Hardware Manufacturing
    • 200 - 300 Employee
    • 高級工程師
      • Jun 2014 - Jul 2015

      Technical Skills, Abilities • Solving issue, logical improvement, issue analysis and new tech study • Possessing mechanical and product design experiences (thermal bonding, CNC, sheet metal, touch design, click pad structure…) • Managing to control product production in manufactory • Managing to control product assembling in assembly factory • Product build trouble shooting, identify risks, issue analysis • Directing and controlling product schedule and ensure the quality EXPERIENCE ASUS UX305(13.3”) (2014~2015) Task: ME Design Engineer/ C & D case Design and MB placement Techniques: C case-->AL(stamping+CNC)+Magnesium+Plastic/ thermal bonding D case-->AL(stamping+CNC)+ Plastic/ thermal bonding Particular: 1. Measuring 12.3mm at its thickest point, That's thinner than Apple's 13”MacBook Air (17mm) 2. White painting on metal coating 3. Change stamping process to make the deformation of D case from 1.2mm to 0.7mm 4. Modify thermal bonding fixture to solve C case deformation issue Show less

    • 高級工程師
      • Oct 2009 - Jun 2014

      EXPERIENCE HP Probook 430 Notebook (13.3”)(2013~2014) Task: ME Design Leader/ Hinge up & C case Design; Leading S 13”/14”/15”/17” LCD design Techniques: Hinge up-->plastic/ soft paint C case-->AL+plastic/thermal bonding Particular: 1. Lead LCD design engineer to do common design, and uses the same part to cost down and reduce issue 2. Fine tune process of B class vendor that the product have good quality 3. Design the hinge fixture to solved hinge cap step issue(step form 0.6 to 0.25) HP ZBook 15 Notebook (15.6”)(2012~2013) Task: ME Design Leader/Hinge up Design; Leading W 15”/17” LCD design Techniques: A Case-->AL+Magnesium+Plastic(insert molding)/thermal bonding B Case-->Plastic+Rubber(double injection)/painting Particular: 1. Lead LCD design engineer to do common design, and uses the same part to cost down and reduce issue 2. Used fixture and change plastic injection temperature to solved LCD Cover “S” deformation issue 3. Co-work with Hinge vendor to define the pick force of hinge torque for one hand open solution(normal type panel and dream color panel) HP ElitePAD 900 Tablet (10.1”)(2012) Task: ME Design Engineer/Dock design Techniques: plastic/ soft paint Particular: Good design and design review that the dock had height quality on SI phase White Box Tablet (10.1”)(2011) Task: ME Design Engineer/Bottom Case design Techniques: Plastic/ special texture Panasonic e-book Tablet UT-PB1 (7”)(2011) Task: ME Design Engineer/Up Case design Techniques: Plastic/ UV painting Particular: High efficiency of issue solving and well-customer communication. Made Panasonic customers kept asking for further chance to cooperate with Compal Acer AS5950G Notebook (15.6”)(2010) Task: ME Design Engineer/D Case design Techniques: Plastic/ Particular: 1.Solved the noise issue on Dolby entertainment product 2. This project was the best project on ACER Huron River project. Won the Annual Best Employee Prize of Compal. (2012) Show less

Education

  • 中原大學
    碩士, 機械工程學系
    2006 - 2008

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