Lea Michaelov

Product Quality & Reliability Engineer at Valens Semiconductor at Valens
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Contact Information
us****@****om
(386) 825-5501
Location
Plano, Texas, United States, US

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Aharon Nagawkar

Lea is a sharp minded student and a have the ability to learn quickly.

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Experience

    • Israel
    • Semiconductor Manufacturing
    • 100 - 200 Employee
    • Product Quality & Reliability Engineer at Valens Semiconductor
      • Sep 2019 - Present

      • Leading Qualification - reliability testing plans & execution, failure analysis and corrective actions implementation of HDBaseT products from pre silicon till production for Automotive and Pro-AV consumer markets. • HW development for qualification of different products with various groups, located in different assembly, test and qual houses. • Safe lunch data review, mission profile evaluation using customer inputs, support RMA and customer audits. • BLR test planning and… Show more • Leading Qualification - reliability testing plans & execution, failure analysis and corrective actions implementation of HDBaseT products from pre silicon till production for Automotive and Pro-AV consumer markets. • HW development for qualification of different products with various groups, located in different assembly, test and qual houses. • Safe lunch data review, mission profile evaluation using customer inputs, support RMA and customer audits. • BLR test planning and execution by customer requirements. Daisy chain planning and design. Show less • Leading Qualification - reliability testing plans & execution, failure analysis and corrective actions implementation of HDBaseT products from pre silicon till production for Automotive and Pro-AV consumer markets. • HW development for qualification of different products with various groups, located in different assembly, test and qual houses. • Safe lunch data review, mission profile evaluation using customer inputs, support RMA and customer audits. • BLR test planning and… Show more • Leading Qualification - reliability testing plans & execution, failure analysis and corrective actions implementation of HDBaseT products from pre silicon till production for Automotive and Pro-AV consumer markets. • HW development for qualification of different products with various groups, located in different assembly, test and qual houses. • Safe lunch data review, mission profile evaluation using customer inputs, support RMA and customer audits. • BLR test planning and execution by customer requirements. Daisy chain planning and design. Show less

    • United States
    • Semiconductor Manufacturing
    • 700 & Above Employee
    • Quality & Reliability Engineer at Intel Corporation
      • Jan 2013 - Sep 2019

      • Leading qualification- reliability testing plans, tests execution, results and failure analysis and corrective actions implementation of wireless products (WiFi 802.11ac/ax, Bluetooth and other emerging technologies). • Package technology risk assessment, package stress planning, execution tracking and reject validation. • Responsible for defining and documenting reliability stress test for package and product qualification. • Define the requirements and analyze results of thermal… Show more • Leading qualification- reliability testing plans, tests execution, results and failure analysis and corrective actions implementation of wireless products (WiFi 802.11ac/ax, Bluetooth and other emerging technologies). • Package technology risk assessment, package stress planning, execution tracking and reject validation. • Responsible for defining and documenting reliability stress test for package and product qualification. • Define the requirements and analyze results of thermal test execution. Show less • Leading qualification- reliability testing plans, tests execution, results and failure analysis and corrective actions implementation of wireless products (WiFi 802.11ac/ax, Bluetooth and other emerging technologies). • Package technology risk assessment, package stress planning, execution tracking and reject validation. • Responsible for defining and documenting reliability stress test for package and product qualification. • Define the requirements and analyze results of thermal… Show more • Leading qualification- reliability testing plans, tests execution, results and failure analysis and corrective actions implementation of wireless products (WiFi 802.11ac/ax, Bluetooth and other emerging technologies). • Package technology risk assessment, package stress planning, execution tracking and reject validation. • Responsible for defining and documenting reliability stress test for package and product qualification. • Define the requirements and analyze results of thermal test execution. Show less

    • United States
    • Semiconductor Manufacturing
    • 700 & Above Employee
    • Freescale Semiconductor – Product Analysis and Characterization Engineer
      • Feb 2011 - Dec 2012

      • Responsible for the characterization of Phase-Locked Loops (PLLs), implemented in the Freescale Semiconductor VLSI devices. • Responsible for the requirements definition for the PLL and high-speed interfaces characterization. • Development of automated characterization environment for VLSI PLLs and clock related circuitry. • Collaboration with the board design teams in the development and the design of the characterization HW.

    • Freescale Semiconductor – Failure Analysis laboratory
      • Jan 2008 - Jan 2011

      • Electrical analysis- working with IREM. Physical analysis (front side de-processing, back side de-processing). • Control the applications of laboratory equipment for maintenance and troubleshooting in real time. • Defining requirements for testing devices after analysis. • Control the navigational tool within the layout (IC Navigation).

Education

  • HIT, Holon Institute of Technology
    Master of Science (MSc), Electrical and Electronics Engineering
    2013 - 2015
  • Electrical Engineering – Afeka, College of Engineering, Tel Aviv, Israel
    Bachelor of Science (BSc), Electrical and Electronics Engineering
    2007 - 2011

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