Experience

Azurewave Technology

• Appliances, Electrical, and Electronics Manufacturing
• 1 - 100 Employee

• Sr. Mechanical Design Engineer

  • Aug 2019 - Present

  Notebook / Mobile phone camera module mechanical design, including placement, plastic / metal part design, DFM with vendor, RFQ prepare, co-work with factory about assembly and debug design issue....etc. Notebook / Mobile phone camera module mechanical design, including placement, plastic / metal part design, DFM with vendor, RFQ prepare, co-work with factory about assembly and debug design issue....etc.



ADATA Technology Co., Ltd.

• Taiwan
• Computer Hardware Manufacturing
• 400 - 500 Employee

• Sr. Mechanical Design Engineer

  • Aug 2017 - Aug 2019

  USB Flash Drive(UFD) / Portable HDD and SSD mechanical design. ● RFQ: according to customer concept, ID, CMF, prepare DFM. ● System placement. ● PCB and FPC outline design, component area planning, PCB panelization design. ● Metal parts design. (Shield frame, shield cover, decoration) ● Plastic parts design. ● Cross functional teamwork with EE, ID, factory ● DFM with supplier. (Plastic parts, metal parts ) ● Mold trial USB Flash Drive(UFD) / Portable HDD and SSD mechanical design. ● RFQ: according to customer concept, ID, CMF, prepare DFM. ● System placement. ● PCB and FPC outline design, component area planning, PCB panelization design. ● Metal parts design. (Shield frame, shield cover, decoration) ● Plastic parts design. ● Cross functional teamwork with EE, ID, factory ● DFM with supplier. (Plastic parts, metal parts ) ● Mold trial



Compal Electronics, Inc.

• Taiwan
• Telecommunications
• 100 - 200 Employee

• Mechanical Design Engineer

  • Oct 2015 - Jul 2017

  Mobile phone mechanical design. ● RFQ: according to customer concept, ID, CMF, prepare DFM. ● System placement. (camera module, finger print, P/L sensor, Mic., speaker, vibrator) ● PCB and FPC outline design, component area planning, PCB panelization design. ● Metal parts design. (Shield frame, shield cover, decoration, camera ring ) ● Plastic parts design. (Housing, Antenna carrier) ● Cross functional teamwork with antenna, EE, acoustics, ID, DQA, factory ● DFM with supplier. (Plastic parts, metal parts ) ● Mold trial ● Business trip for factory trial production. Show less



凱勒斯科技有限公司

• 台灣 New Taipei City 五股區

• Equipment Design and Process Engineer

  • May 2012 - Jun 2015

  LED wafer thinning process equipment and process development. ● Wax bonding, Grinding, Diamond Polish, CMP equipment and process deveplopment. ● Equipment mechanical design, software maintain(PLC) ● Customer side service ● The development department ISO9001 and QC080000 in charge and drawing up. ● Year-end party host. ● Co-work directly with Japan, Korea and Russia partners. LED wafer thinning process equipment and process development. ● Wax bonding, Grinding, Diamond Polish, CMP equipment and process deveplopment. ● Equipment mechanical design, software maintain(PLC) ● Customer side service ● The development department ISO9001 and QC080000 in charge and drawing up. ● Year-end party host. ● Co-work directly with Japan, Korea and Russia partners.