Experience

Heraeus Electronics

• Germany
• Appliances, Electrical, and Electronics Manufacturing
• 100 - 200 Employee

• Senior Technical Solution Engineer

  • Feb 2017 - Present

  • Provides technical support in the Asia Pacific region (exclude China), which primarily focusing on Power semiconductor, Advanced packaging, LEDs Sinter, and automotive industries. • Support product qualification and new product evaluations through on-site customer support. • Provide technical solutions focusing on process design guidelines and value-added services to customer. • Work closely with R&D group on the new product development focusing on advanced packaging/SIP, power discrete die attach, and Ag sintering segments. • Apply project management skills to drive for technical projects, which include technology transfers, process solutions, new product implementation & emerging technologies. • Communicate & update technical issues related to new product development status to Marketing and R&D teams. • Perform In-house material simulation and characterization study through series of DOEs defined using internal testing equipment. • Familiar and well trained on the market leading semiconductor equipment, such as flip chip/die bonder, chip shooter, dispenser, reflow oven and etc. • Conduct comprehensive failure analysis study on the samples, such as SEM-EDX, Auger, TOF-SIMS, DSC, FTIR, TGA and etc. to understand the failure mode mechanism. • Support internal quality and engineering team in handling customers' complaint through 8D approach to solve the application issues. • Well trained and apply Challenger sales approach in winning the sales opportunity for the Top listed CRM business opportunities. Show less



Indium Corporation

• United States
• Appliances, Electrical, and Electronics Manufacturing
• 400 - 500 Employee

• Senior Technical Support Engineer

  • Jun 2014 - Feb 2017

  • Provides technical support in the Southeast Asia region, which primarily supports Malaysia, Singapore, and Indonesia customers. • Engage closely with customers specialty in both semiconductor and surface mount technology to offer technical solutions related to process design and material applications. • To troubleshoot process issue at customer’s site and determine the root cause(s). Provide solutions to resolve the problems. • Subject material expert in soldering materials applications, such as screen printing, dispensing, chips/die placement, reflow process, and etc. • Provide technical seminar and training to customers in soldering materials (alloy, fluxes, solder pastes, solder wire, Ag sinter and etc) rheology and properties. • Use of structured DoEs to optimize processes and determine root-causes while convey the key learning to internal team. • Engage with product development group (product manager and R&D) in defining the customers' explicit needs and suitable product offering. Show less



Motorola Solutions

• United States
• Telecommunications
• 700 & Above Employee

• Process Engineer

  • Aug 2010 - May 2014

  • Highly experienced in surface mount technology (SMT) process and equipment. • Provide technical support to value streams through lean six sigma implementation at Frontend SMT manufacturing. • Responsible for sustaining and improve the products yield rate through six sigma approach. • Applied statistical process control (SPC) analytical tools (8D, FMEA, MSA) and DMAIC approach in identify and implement cost reduction opportunities. • Responsible for setup DOE, work instruction, control plan, FMEA and work flow for new processes. • Involve in Design for manufacturing (DFM) phase of new products development to provide optimal and robust design. • Experienced in products failure analysis (FA) methodology, such as SEM-EDX, CSAM, Strain-gauge, Thermal shock. • Team lead for SMT FrontEnd process during new product transfer and technology transfer from United State-Mexico manufacturing sites. • Equipment engineer and subject matter expert for screen printing machines. • Role as team lead in governing overall screen printer performance and decision making in machine capability justification and layout. • Responsible for future technology platform aligned with product roadmap/milestones for screen printers across manufacturing sites globally. • Responsible as Equipment champion for sub assembly processes such as router, epoxy underfill dispensing, wave soldering, and automated inspection (AOI) machines. • Familiar with ISO 9001:2008 and Quality system assessment (QSA) audit. Show less