Airborne Electronic Hardware Engineer

• Nov 2022 - Present

Technical Lead

• Jun 2022 - Oct 2022

Product Development Engineer

• Sep 2020 - May 2022

· Project lead - responsible for product management, schedule, administering budget, effectively delegate and manage work to cross functional team members (Includes Software, Mechanical, Mobile application developer, Manufacturing service provider and external contractors) of the team. · Manufacturing supplier identification for the program, EOL test support, Test-Jig/break out box design. · Designed a fully user configurable digital outputs with Class 0.2 accuracy and supervised PCB design. · Flyback converter power supply design with custom transformer to support low and medium power. · Air core motor control design for Synchroscope product. · Performed Worst case circuit analysis (WCCA), error analysis (OPAMP, ADC), thermal analysis, FMEA for the component/system, tungsten filament characterization, Worst case analysis, Monte Carlo, Sensitivity analysis. · Perform Board bring up, design verification test, thermal analysis. · Power supply validation, battery characterization and testing. · Designed Bluetooth interface with surface mount chip antenna and Nordic NRF52833 MCU. · EMI/EMC, ESD, Environmental, FCC, CE, ANSI C39.1, UL 61010-1 and BLE SIG certification test support.

Senior Electrical Engineer

• Nov 2017 - Sep 2020

· Electrical lead - responsible for all Hardware deliverables. Coordinated on technical front with the Client team and cross functional teams (BSP Firmware, Mechanical, PCB) throughout the product development. · Ownership of Hardware-software interface specification (HSIS); Hardware safety requirements (HSR) extract from technical safety requirements (TSR). · Buck and Boost power converter design and development, Gate driver design, FMEA, FTA, RCA · Prepared high-level & low-level design documents by doing analysis, simulation and component selection based on system requirement specification. · Prepared layout constraint document and worked along with PCBA team for component placement/routing. · Coordinated with mechanical team for thermal consideration and Manufacturing team for DFM/DFT. · Coordinated with illumination team for requirement finalization for telltales and TFT display illumination. · Designed breakout box (Test Jig) for product validation and EBOM release for purchasing and build. · Prepared Test document for Board bring up, functional level validation, design level validation, system integration testing, power validation, sleep current validation. · Responsible for FMEA, functional safety part 5 (ISO 26262-5) and automotive pulse tests (ISO 7637-2).

Lead Engineer

• May 2017 - Oct 2017

Design of test system for Windmill electronics.• Responsible for preparing high level & low level design documents by doing analysis, simulation and component selection based on system requirements.• Schematics design with Altium designer.• Prepared layout constrain document and worked along with layout team for component placement and routing. Coordinated with mechanical team for thermal consideration and fitment.• Layout review of the board like PCB routing check, monitoring critical paths, following the layout guidelines and Taking appropriate actions.• Test document preparation and testing- Board bring up, functional level validation, design level validation, system integration testing, bug tracking and closure.

Lead Engineer

• Nov 2015 - Apr 2017

Avionics electronics product requirement verification and validation.• To provide onsite Technical support in the Client Place - UTC Aerospace Systems.• Lead the local Technical Support Engineers.• Good understanding with the Client according to the requirements.• Design validation of slat/flap actuator electronics control unit.• Functional and Test specification document preparation for all products.• Preparation of various Product documents as needed.• Requirement management with DOORS.

Lead Engineer

• Jan 2014 - Nov 2015

Avionics electronics product design• Module owner, Responsible for preparing high level & low level design documents by doing analysis, simulation and component selection based on system requirements.• Schematics design with Cadence concept HDL.• Analog circuits design – ADC, DAC, Op-Amp, Transistor and MOSFET Circuit Simulation and Analysis• Design analysis such as Power, worst case stress analysis, OPAMP error analysis Logic Compatibility, Fan-out and Thermal analysis.• Power solution/power architecture- DC/DC converter and LDO.• Prepared layout constrain document and worked along with layout team for component placement and routing. Coordinated with mechanical team for thermal consideration and fitment.• Layout review of the board like PCB routing check, monitoring critical paths, following the layout guidelines and Taking appropriate actions.• Test document preparation and testing- Board bring up, functional level validation, design level validation, system integration testing, bug tracking and closure • Hands on experience in DO160F, DO254 designs

MTS - Hardware

• Oct 2010 - Dec 2013

Joined HCL as a Fresher out of college.Worked as a Design Engineer in Hardware Product Engineering Group of HCL Technologies Engineering R&D Services Division.Avionics electronic product design• Worked on Schematic Drawing, Design Analysis, Component selection and list preparation, Layout support, Device Verification Testing, Hardware-Firmware testing, System level testing and debugging.• DC-DC Power supply Design, Control loop and stability analysis and through validation• BoM creation, coordination with vendor / suppliers for PCB fab and assembly• Logic, AC and DC compatibility analysis• End-to-End Design Validation Testing, EVT, DVT and PVT