JOHNNY BLAS

PH QUALITY MANAGER at Cohu Philippines (Delta Design Philippines LLC)
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Contact Information
us****@****om
(386) 825-5501
Location
Calabarzon, Philippines, PH
Languages
  • English Full professional proficiency
  • Tagalog Native or bilingual proficiency
  • Mandarin Chinese Professional working proficiency
  • Fookien Chinese Native or bilingual proficiency

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5.0

/5.0
/ Based on 15 ratings
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William So

I had the pleasure to work with John. He is a true professional, focused, results oriented and very capable program manager. He is self starter and provides timely project updates.

Walter Dela Cruz, MMgmt

John heads the team as a model leader. A good motivator, mentor & trainer. Hands-on at all issues, never leave his people at any problem and very known to his innovative solutions. Very knowledgeable in Operations (FOL, EOL & TEST), NPI & Planning. I consider him as the best manager I had and will be much willing to be his member again. As his favorite quote "when you commit, you must deliver", he always balance commitment with accountability and sensitivity to members' capability.

Joe F.

I had the privilege to work with John for a full year. He was the head of our team managing OSAT; I was in his Test Engineering team. He was the one who hired me. He is fair to everyone and opens opportunities to anyone, in my case not minding my 4-year gap between jobs. John is the kind of leader whom i will follow because of respect - not because of fear. He is a great leader and a source of motivation in a fast-paced industry and will be a big asset to any organization. I would love to work with him again.

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Credentials

  • SIX SIGMA GREEN BELT
    onsemi
    Dec, 2012
    - Nov, 2024
  • MASTER PROJECT MANAGER
    AAPM ® American Academy of Project Management ®
    May, 2012
    - Nov, 2024
  • REGISTERED ELECTRICAL ENGINEER
    Philippine Professional Regulation Commission
    Jul, 1994
    - Nov, 2024

Experience

    • Philippines
    • Appliances, Electrical, and Electronics Manufacturing
    • 100 - 200 Employee
    • PH QUALITY MANAGER
      • Sep 2022 - Present

      Head of Quality of PH Manufacturing Factories. Head of Quality of PH Manufacturing Factories.

    • United States
    • Appliances, Electrical, and Electronics Manufacturing
    • 700 & Above Employee
    • SUBCONTRACTOR (OSAT) MANAGEMENT HEAD
      • Nov 2017 - Jan 2022

      Started-up, Ran, and Grew Vishay Mosfet's External Mfg. / Subcon (OSAT) Management Operations from Womb to Tomb. Including New Package Development (NPD), New Product Introduction (NPI) Project Mangement, Assembly & Test Engineering, Quality and Planning. Managing a total of 14 Subcontractors globally with Annual Revenue of $120M in 2021. Started-up, Ran, and Grew Vishay Mosfet's External Mfg. / Subcon (OSAT) Management Operations from Womb to Tomb. Including New Package Development (NPD), New Product Introduction (NPI) Project Mangement, Assembly & Test Engineering, Quality and Planning. Managing a total of 14 Subcontractors globally with Annual Revenue of $120M in 2021.

    • United States
    • Semiconductors
    • 700 & Above Employee
    • REGIONAL I.T. PMO SR. MANAGER (APAC)
      • Oct 2015 - Nov 2017

      Leads IT APAC Regional PMO (Program Management Office) and Global Data Analytics teams. A team of Project Managers and Data Analysts globally. Managing global strategic IT programs and projects globally. That is MES, ERP, Infrastructure, and IT Security.

    • TECHNICAL PROGRAM MANAGER / ad.in. NPD MANAGER (Concurrent Positions from Jan. to April 2012)
      • Aug 2008 - Oct 2015

      TECHNICAL PROGRAM MANAGER (Oct 2011 – Oct 2015) / NPD MANAGER (Concurrent Position from Jan to Apr 2012)Functional Responsibilities: Leads & Manages large scale strategic programs related to New Package Platform introduction and start-up, Capacity Expansion (Probe, Assembly, & Test), Plant-wide Cost Savings, & In-sourcing Projects. Also concurrently handled the New Package Development Dep’t. in 2012OSAT SUBCON ENGINEERING & PROGRAM MANAGER (Aug. 2008 – October 2011)Functional Responsibilities: Leads & Manages large scale strategic programs for ON's Global External Mfg. Operations. Example of which is the Subcontructor Consolidation Program (consolidating ~67 subcontractors to 40 subcontractors) through Portfolio consolidation, Insourcing, Subcon exit, & Product pruning. Show less

    • United States
    • Semiconductor Manufacturing
    • 700 & Above Employee
    • NEW PRODUCT/PACKAGE DEVELOPMENT DEPARTMENT MANAGER (NPD)
      • Jun 2008 - Aug 2008

      NEW PRODUCT & PACKAGE DEVELOPMENT DEPARTMENT MANAGER FOR MODULE & WLP ASSEMBLY (Jun 2008 – Aug 2008) Functional Responsibilities: Manages the New Product/Package Development Department - works with Corporate HQ for Product & Package Development activities, Prototyping, Process simulation, and Development. Drives Process improvements & company-wide SPC, FMEA, & 8D programs & Handles Maxim Evaluation Kit Line operations NEW PRODUCT & PACKAGE DEVELOPMENT DEPARTMENT MANAGER FOR MODULE & WLP ASSEMBLY (Jun 2008 – Aug 2008) Functional Responsibilities: Manages the New Product/Package Development Department - works with Corporate HQ for Product & Package Development activities, Prototyping, Process simulation, and Development. Drives Process improvements & company-wide SPC, FMEA, & 8D programs & Handles Maxim Evaluation Kit Line operations

    • Netherlands
    • Semiconductor Manufacturing
    • 700 & Above Employee
    • PROJECT ENGINEERING MANAGER (SIPs + BUMPING) RF BU
      • Aug 2006 - Jan 2008

      PROJECT ENGINEERING MANAGER (Aug. 2006 to Jan. 2008) RF BUFunctional Responsibilities: Responsible for developing, leading cross-functional teams, planning, coordinating & implementing New RF Products, RF technologies & Projects to meet the current & future requirements of NXP Semiconductors (SiPS – System-in-Package Solution Division) and its customers. Leads an engineering team that is responsible for large scale projects related but not limited to New Package & Product Introduction (Assembly - Test), Initial Production & Volume Ramp-up Management; Projects related to the development and introduction New Materials, Process, & Technology; & Manages Cost Reduction & Improvement Projects. Led the Product Transfer & Closure of SiPS factory. Show less

    • WAFER + FINAL TEST NPI AND BU ACCOUNT MANAGER / WAFER + FINAL TEST EQUIPMENT ENGINEERING MANAGER
      • Oct 1999 - Jul 2006

      TEST NPI AND BU ACCOUNT MANAGER (Jan 2004 to Jul 2006)Functional Responsibilities: Heads/Leads the Account Management Team - Responsible for overall Customer Portfolio Management; Liaises between Customer (BU/BL) and Plant (PSC); Handles New Product Introduction at Wafer & Final Test, Operational Indicators, Quality Issues, Supplier Rating System, & Coordination between PSC & Customers TEST EQUIPMENT ENGINEERING (WAFER & FINAL TEST) MANAGER (Mar 2002 to Dec 2003)Functional Responsibilities: Responsible for overall Test Equipment (Handler / Prober) Management, i.e., Equipment Road mapping, Planning, Selection, Buyoff, & Qualification; Equipment Performance Management – TPM, OEE, improving uptime, MUBA, MTBF, Set-up time, etc.; Equipment Maintenance Program – Preventive & Predictive Maintenance; Spare Parts Management – Spare parts inventory management, Supplier sourcing, Consignment programs, & Cost management; Engineers & Technicians management and development – Training and competency developmentCHIEF TECHNICAL PROGRAM ENGINEER – ASSEMBLY & TEST (Oct 1999 to Mar 2002)Functional Responsibilities: Project Management in both semiconductor Assembly and Test - Responsible for New Product Introduction, Technology Development & Implementation. Monitors and improves yield for newly introduced products using statistical approach. Lead the Start-up and Ramp-up of PSC in the area of product & technology introduction Show less

    • United States
    • Semiconductor Manufacturing
    • 700 & Above Employee
    • SR. PROCESS (FOL) / PACKAGE DEVELOPMENT ENGINEER (FOL + EOL)
      • Jan 1996 - Oct 1999

      SR. PROCESS ENGINEER - DIE SALES + FOL ASSEMBLY (Nov 1997 to Oct 1999) Functional Responsibilities: Responsible for Process Improvements, Yield, Quality & Cycle time Improvement and breakthroughs; Supports new product, process, technology, & equipment introduction; Handles line sustaining of the entire PLCC Front-of-Line operations, specializing in 2/O, Wafer Mount & Saw, Die Attach, Wire Bond, & 3/O; Conducts DOEs, SPCs, FMEAs, MPCpS & etc.; Customer Focus Engineer for Major ATP customers, like Atmel, AMD, Motorola, & Bosch. Led the Start-up & Ramp-up of Die Sales business at Amkor Plant 2. PACKAGE/PRODUCT DEVELOPMENT ENGINEER II - FOL & EOL (Jan 1996 to Nov 1997) Functional Responsibilities: Responsible for establishing future technical capabilities today; Responsible for planning, developing, & implementing new packaging technology based on APQP; Responsible for conducting technical evaluations and projects aimed at package, materials, and process improvement and cost reduction; Responsible for reviewing, planning, overseeing and monitoring evaluation and qualification runs on new/improved/upgraded customer devices based on company’s capabilities and customer's specifications/requirements; Responsible for training mfg. personnel on New technology and Specs. Specializes in Die Attach, Wire Bond, Mold and Trim and Form. Show less

    • United States
    • Computers and Electronics Manufacturing
    • 700 & Above Employee
    • EOL MANUFACTURING ENGINEER (PROCESS AND EQUIPMENT)
      • Jan 1994 - Dec 1995

      MANUFACTURING ENGINEER – EOL ASSEMBLY PROCESS AND EQUIPMENT (Jan 1994 to Dec 1995) Functional Responsibilities: Responsible for Process & Yield improvements projects for SOIC; Conducts DOEs, SPCs, FMEAs, MPCpS & etc.; Supports new product, process, & technology introduction; Generates process specifications and OPL. Equipment Engineering: Repair and Maintenance, PM, Tooling Mgt., Areas of expertise are Mold, Laser Mark, Trim and Form and Tape and Reel. MANUFACTURING ENGINEER – EOL ASSEMBLY PROCESS AND EQUIPMENT (Jan 1994 to Dec 1995) Functional Responsibilities: Responsible for Process & Yield improvements projects for SOIC; Conducts DOEs, SPCs, FMEAs, MPCpS & etc.; Supports new product, process, & technology introduction; Generates process specifications and OPL. Equipment Engineering: Repair and Maintenance, PM, Tooling Mgt., Areas of expertise are Mold, Laser Mark, Trim and Form and Tape and Reel.

Education

  • University of Santo Tomas
    Master's degree, Management Engineering
    1996 - 1999
  • University of Santo Tomas
    Bachelor of Science (BS), Electrical Engineering
    1988 - 1993

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