Experience

WaferTech

• United States
• Semiconductor Manufacturing
• 300 - 400 Employee

• Sr. Process Integration Engineer

  • Jun 2019 - Present

  • Implemented TSMC automotive 2.0 systems in WaferTech as qualified automotive Fab for automotive customers.• Transferred new products and technologies from other TSMC’s fabs and successfully ramp to high volume production.

• Sr. Thin Film Process Engineer

  • Apr 2016 - Jun 2019

  • ThinFilm process engineer on CVD process productivity improvement and problem solving.• Working with TSMC headquarter CVD technical board to implement or transfer cross fabs updated recipes and technical solutions.• Inline process SPC and real time process parameter maintenance and improvement.• Working with cross departments for product or technology transfer and technical CVD process issues.

• Sr. Process Integration Engineer

  • Jan 2007 - Mar 2016

  • Conducted Wafer Accept Test data analysis and CP/CPK improvements.• Conducted troubleshooting on WAT related problems root cause finding, and solution implementation.• Conducted DOE planning on customer products and utilized data mining/analysis tool for ANOVA analysis.• Process route creation and process window optimization.• Sustained and improved current products and processes in the fab.• Led a multi-functional team for fab event handing and developing technical solution.• Transferred new products and technologies from other TSMC’s fabs and successfully ramp to high volume production• Worked with customer/product/quality engineers to provide process solutions for customer quality improvement. Show less

• Sr. Product Engineer

  • Oct 2000 - Dec 2007

  • Product yield analysis/enhancement.• Product WAT/CP/FT correlation to identify parametric related issue.• Design rule check for new products tape-out.• Low yield products failure analysis including physical FA and electrical FA.• Customer field return issue handling and analysis to find out the root cause.• Mentored entry-level engineers and technicians.• Worked with testing engineers to identify product overkill/marginal problem.• Worked with process engineers for products yield improvements.• Worked with TSMC’s other fabs to transfer new products.• Worked with customer’s engineers, sales and customers for quality customer services. Show less