Experience

Persimmon Technologies Corporation

• United States
• Semiconductor Manufacturing
• 1 - 100 Employee

• Senior Mechanical Engineer

  • Feb 2022 - Present



EFI

• United States
• Printing Services
• 700 & Above Employee

• Senior Mechanical Engineer

  • Jul 2019 - Feb 2022



Cambridge Technology, a Novanta Company

• United States
• Appliances, Electrical, and Electronics Manufacturing
• 1 - 100 Employee

• Senior Mechanical Engineer

  • Mar 2017 - Jul 2019



Brooks Automation

• United States
• Semiconductor Manufacturing
• 700 & Above Employee

• Product Engineer

  • Sep 2015 - Mar 2017

  Product Engineer for CTI Cryogenics Division Product Engineer for CTI Cryogenics Division



Nissin Ion Equipment USA

• United States
• Semiconductor Manufacturing
• 1 - 100 Employee

• Senior Mechanical Engineer

  • Oct 2012 - Sep 2015

  Mechanical design, thermal and structural analysis on next generation ion implant technology. Mechanical design, thermal and structural analysis on next generation ion implant technology.



ASMPT NEXX, Inc.

• United States
• Semiconductor Manufacturing
• 100 - 200 Employee

• Senior Mechanical Engineer

  • Aug 2011 - Oct 2012

  Mechanical design, analysis, reliability improvements, field service support on PVD (sputtering) tool. Mechanical design, analysis, reliability improvements, field service support on PVD (sputtering) tool.



VEECO SOLAR EQUIPMENT

• Senior Mechanical Engineer

  • Sep 2008 - Jul 2011

  Was part of engineering team which designed and developed vacuum deposition tools for thin-film solar photovoltaic panels. Was part of engineering team which designed and developed vacuum deposition tools for thin-film solar photovoltaic panels.



Ferrotec

• United States
• Semiconductor Manufacturing
• 200 - 300 Employee

• Design and Applications Engineer

  • Sep 2005 - Aug 2008

  Evaluated customer applications and performed design and analysis work on ferrofluidic (magnetic fluid) seals, spindles, and electro-mechanical sealing subsystems (such as motorized spindles and wafer handlers) for the semiconductor, fiber optic, and defense/aerospace markets. Evaluated customer applications and performed design and analysis work on ferrofluidic (magnetic fluid) seals, spindles, and electro-mechanical sealing subsystems (such as motorized spindles and wafer handlers) for the semiconductor, fiber optic, and defense/aerospace markets.



Axcelis Technologies

• United States
• Semiconductor Manufacturing
• 700 & Above Employee

• Mechanical Engineer - Contract

  • Jul 2004 - Sep 2005

  Had mechanical design responsibility for motorized vacuum wafer handling system for ion implant end station. The design was successful and was a key component in a new ion implant tool. Had mechanical design responsibility for motorized vacuum wafer handling system for ion implant end station. The design was successful and was a key component in a new ion implant tool.



Ferrofluidics

• Mechanical Engineer

  • Oct 1987 - Aug 2001

  Performed testing,R&D, and design work on fluid film bearing spindles, loudspeakers, and rotary seals utilizing ferrofuidic technology. Performed testing,R&D, and design work on fluid film bearing spindles, loudspeakers, and rotary seals utilizing ferrofuidic technology.