Experience

Tego, Inc.

• United States
• Automation Machinery Manufacturing
• 1 - 100 Employee

• Manager Engineering Development

  • May 2008 - Present

  Original member of the hardware design team. Implemented a successful card-based IC validation platform design for a high memory, ruggedized RFID IC. Developed RFID Tag products for Aerospace and Life Science industries that endure extreme environmental conditions including gamma and e-Beam sterilization. Managed RFID and IC product supply chain. Selected and managed manufacturing contractors. Defined and executed customer pilot programs. Personal Management: lab manager. Managed the IT infrastructure. Show less



AppliedMicro

• United States
• Semiconductor Manufacturing
• 100 - 200 Employee

• Principal Development Engineer

  • Mar 2007 - May 2008

  Developed an IC validation platform for the development of a 10G LAN/WAN/OTN Framer-Mapper-PHY IC for AMMC’s carrier division. The successful design was delivered to the IC validation team in 6 months. Responsibilities included, PCB manufacturing and assembly contractor evaluation, architecture definition, design, PCB layout, manufacturing, test/debug and documentation. Developed an SFP+ reference platform for AMCC’s QT2035S 10 Gigabit Ethernet (Gbe) physical Layer (PHY) IC. The hardware design was delivered on time to the sales and marketing team for the product introduction. Show less



Transwitch

• United States
• Semiconductors
• 1 - 100 Employee

• Principal Member Technical Staff

  • Nov 1999 - Oct 2007

  Onex Communications, Inc., Bedford, MA - Acquired by Transwitch Corporation, 2001 Original member of the hardware design team. Lead the development of a SONET/SDH reference platform for testing and evaluating ICs developed for Metro Core solutions. Defined the platform architecture consisting of 12U 23inch cage, CPU card, -48v DC system power modules and designed and developed the OC-3/12/48 SONET I/O - Switch Module and system backplane. Designed and equipped two labs with equipment including scopes, signal generators and power supplies. Successfully integrated the platform into a customer’s solution Personal Management: Validation team consisting of 2 engineers, 1 technician and 10 software engineers, local and overseas. Interviewed candidates, hiring recommendations, planed and scheduled work, assigned work, checked and approved work, conducted performance evaluations, recommended salary adjustments. Technologies I/O-Switch: FR4 16-layer PCB, DC/DC, PLX cPCI bridge, Altera FPGAs and CLPD, UTOPIA, DSP, ZBTSRAM and FCRAM. Backplane: FR4 22-layer PCB, 2.4Gbit & cPCI COM buses, -48v power. Show less



Nokia

• Finland
• Telecommunications
• 700 & Above Employee

• Senior Hardware Engineer

  • Sep 1996 - Nov 1999

  Member of the hardware team for the ATM networking division. Developed an ATM 2.5 Gbit switch and Node Synchronization (BITS) module for an IP/ATM data communications system. Duties included design, documentation, schematic capture, layout and unit test. Team member contributing to the design of an IC test card. Work included defining termination for multiple 194 MHz LVDS lines, IC to IC interface timing, connectors and ISA interface to a PC. Responsible for schematic capture, layout and unit test. Defined the requirements and architecture for an IP over SONET OC-48 module to be used in an IP edge router. Evaluated memory solutions SSRAM and DRAM, OC-12/48 optical modules, IP over SONET (POS) framers and PCI bridges. Show less



Telco Systems | Edgility

• United States
• Telecommunications
• 100 - 200 Employee

• Associate Hardware Engineer

  • Sep 1989 - Sep 1996

  Member of the hardware team tasked to investigate new technologies for next generation telecommunication systems. Evaluated high speed backplane communications bus utilizing TDR measurements; reported results were used to validate Spice modeling. Evaluated -48v power distribution and DC/DC power modules to be used on system cards. Assisted in UL, EMC/EMI and NEBS (Network Equipment Building Systems) certification testing on new telecommunications product line. Modified optical transport cards to SC style connectors. Developed SCPC terminating and polishing procedures for manufacturing to meet insertion loss and reflection requirements. Show less