Experience

Actiontec Electronics

• United States
• Telecommunications
• 1 - 100 Employee

• Senior Hardware Engineer

  • May 2014 - Present

  1. Experienced in Power Amplifiers, LNA matching and improving, EVM, Tx power quality and etc. -. Impedance matching use Network Analyzer. 2. Transmitter and Receiver performance verified and troubleshooting using IQview. -. The Tx and Rx spec base on IEEE in WiFi 801.11.b/g/n/ac/ax. -. Front End Module verified with Skyworks and Qorvo chipset. -. The verified calibration and tools. 3. OTA testing and tuning for the performance improving with Anechoic chamber. 4. Schematic and PCB Layout using Orcad of Cadence design tools. 5. Experienced in FCC approved and troubleshooting. -. Digital emission and spurious in band and out band. -. Transmitter power quality and restricted band edge emission. 6. The developments product concept as follow. (801.11 n/ac/ax) -. 2.4GHz & 5GHz, 4x4 MIMO, Internal antennas. -. 2.4GHz & 5GHz, 2x2 MIMO, Internal antennas.



Argela Technologies

• Türkiye
• Telecommunications
• 100 - 200 Employee

• Hardware System Engineer

  • Apr 2013 - Apr 2014

  • WCDMA Indoor and Outdoor BTS System Development. (Pico/Micro) • The hardware designed and developed of WCDMA using Pico chip for BTS System. • WCDMA Indoor and Outdoor BTS System Development. (Pico/Micro) • The hardware designed and developed of WCDMA using Pico chip for BTS System.



Minieum Networks

• Senior Hardware Engineer

  • Oct 2010 - Apr 2013

  • WCDMA Femto/Pico/Micro System Development for Enterprise solution. • The hardware designed and developed of WCDMA using Pico chip for BTS System. • WiFi 802.11 b/g/n Support. • WCDMA Femto/Pico/Micro System Development for Enterprise solution. • The hardware designed and developed of WCDMA using Pico chip for BTS System. • WiFi 802.11 b/g/n Support.



Flextronics

• United States

• Staff Hardware Engineer

  • Feb 2004 - Oct 2007

  • Hardware project manager at White and K2 project for Toshiba and QCT product. • Designed and developed of WCDMA and GSM band RF part using MSM chip-sets for mobile Phone. • Designed and developed of CDMA and PCS band RF part using MSM chip-sets for Mobile Phone. • Move to Mteksoft due to Flextronics Design Korea closed. • Hardware project manager at White and K2 project for Toshiba and QCT product. • Designed and developed of WCDMA and GSM band RF part using MSM chip-sets for mobile Phone. • Designed and developed of CDMA and PCS band RF part using MSM chip-sets for Mobile Phone. • Move to Mteksoft due to Flextronics Design Korea closed.