Experience

Sonata Scientific

• United States
• Nanotechnology Research
• 1 - 100 Employee

• Co-Founder and COO

  • Dec 2022 - Present

  Sonata Scientific develops products to provide industrial air quality using novel air purification technologies. Responsible for operations and product development.

• Co-Founder and CTO

  • Mar 2018 - Jan 2023

  New initiative with technical team and R&D assets from Sonata LLC focused on improving health and well being through advanced materials technology.



CT Thin Film Technologies LLC

• President

  • Aug 2009 - Present

  Subject matter expert in semiconductor materials, process and device patents, specializing in advanced materials, chemical vapor deposition and atomic layer deposition. Subject matter expert in semiconductor materials, process and device patents, specializing in advanced materials, chemical vapor deposition and atomic layer deposition.



Sonata LLC

• Director of Products and Managing Partner

  • May 2010 - Oct 2018

  Responsible for commercial product management and new product development of materials for advanced energy, lighting and related applications. Established business, acquired customers and managed qualifications, resulting in high volume commercial sales of ultrahigh purity metalorganics used in LEDs, solar cells, and other III-V devices. Established laboratory with thin film deposition tools and characterization equipment. Initiated advanced materials R&D with funding from DOE, NSF, USDA, and… Show more Responsible for commercial product management and new product development of materials for advanced energy, lighting and related applications. Established business, acquired customers and managed qualifications, resulting in high volume commercial sales of ultrahigh purity metalorganics used in LEDs, solar cells, and other III-V devices. Established laboratory with thin film deposition tools and characterization equipment. Initiated advanced materials R&D with funding from DOE, NSF, USDA, and NIH. Successfully exited business by sale of selected assets to manufacturing partner. Show less Responsible for commercial product management and new product development of materials for advanced energy, lighting and related applications. Established business, acquired customers and managed qualifications, resulting in high volume commercial sales of ultrahigh purity metalorganics used in LEDs, solar cells, and other III-V devices. Established laboratory with thin film deposition tools and characterization equipment. Initiated advanced materials R&D with funding from DOE, NSF, USDA, and… Show more Responsible for commercial product management and new product development of materials for advanced energy, lighting and related applications. Established business, acquired customers and managed qualifications, resulting in high volume commercial sales of ultrahigh purity metalorganics used in LEDs, solar cells, and other III-V devices. Established laboratory with thin film deposition tools and characterization equipment. Initiated advanced materials R&D with funding from DOE, NSF, USDA, and NIH. Successfully exited business by sale of selected assets to manufacturing partner. Show less



ATMI

• United States
• Semiconductor Manufacturing
• 1 - 100 Employee

• Director of R&D

  • Jan 2001 - Aug 2009

  Responsible for CVD/ALD chemistry, process, and sensor development for advanced semiconductor applications. Capital planning and execution, collaborative relationship development and intellectual property portfolio management. Group developed processes leading to state of the art thin films for Cu barrier/seed, high frequency dielectrics, phase change memory, nitrides and many other applications resulting in commercial products. Demonstrated first solid-state in-situ fluorine sensor… Show more Responsible for CVD/ALD chemistry, process, and sensor development for advanced semiconductor applications. Capital planning and execution, collaborative relationship development and intellectual property portfolio management. Group developed processes leading to state of the art thin films for Cu barrier/seed, high frequency dielectrics, phase change memory, nitrides and many other applications resulting in commercial products. Demonstrated first solid-state in-situ fluorine sensor for vacuum chamber clean end-pointing with etch savings up to 100%. Installed several clean rooms, 200 & 300mm dry and wet film processing equipment, and defect inspection (AMAT, ASM, Lam, KLA, Semitool, Hitachi) that enabled successful new product development.

• Manager, Process Development

  • Jan 1996 - Dec 2000

  Managed MOCVD process development group. Research programs included Pb(Zr,Ti)O3 (PZT) for piezoelectric and pyroelectric applications, SrBi2Ta2O9 (SBT) for FeRAMs, and Ni-Zn ferrites for wireless communications. Initiated collaborations with leading device manufacturers leading to commercialization. Group also developed novel solid-state gas sensors for hydrogen and fluorine. Staff successfully won programs from NIST (ATP), DOE, and DARPA. Expanded research scope to include noble… Show more Managed MOCVD process development group. Research programs included Pb(Zr,Ti)O3 (PZT) for piezoelectric and pyroelectric applications, SrBi2Ta2O9 (SBT) for FeRAMs, and Ni-Zn ferrites for wireless communications. Initiated collaborations with leading device manufacturers leading to commercialization. Group also developed novel solid-state gas sensors for hydrogen and fluorine. Staff successfully won programs from NIST (ATP), DOE, and DARPA. Expanded research scope to include noble metal electrodes, silicate-based high k gate dielectrics, diffusion barriers, and low k materials to support commercial CVD chemical business objectives.



Advanced Technology Materials

• Research Engineer

  • Sep 1993 - Dec 1998

  Developed MOCVD processes to deposit multicomponent thin films for electro-optic, pyroelectric, and piezoelectric devices. Generated outside funding of >$2M, and contributed to obtaining several other funded efforts totaling >$2M. Expanded the company's ferroelectric materials R&D efforts from BST to include PZT and SBT. Initiated collaborative development programs with Texas Instruments, Honeywell, Bell Laboratories and North Carolina State University. Developed MOCVD processes to deposit multicomponent thin films for electro-optic, pyroelectric, and piezoelectric devices. Generated outside funding of >$2M, and contributed to obtaining several other funded efforts totaling >$2M. Expanded the company's ferroelectric materials R&D efforts from BST to include PZT and SBT. Initiated collaborative development programs with Texas Instruments, Honeywell, Bell Laboratories and North Carolina State University.



IBM

• United States
• IT Services and IT Consulting
• 700 & Above Employee

• Staff Engineer

  • Feb 1989 - Sep 1993

  Developed controlled collapse chip connection (C4) processes for high density microelectronic interconnection in logic and memory devices. Investigated solder / metallization reactions, conducted alpha-particle emission spectroscopy, and developed creep and fatigue resistant Pb-based solder alloys with IBM Federal Systems Division. Assisted in coordinating team efforts for 30+ step integration process and developed processes for wet and dry thin film etching through collaboration with IBM… Show more Developed controlled collapse chip connection (C4) processes for high density microelectronic interconnection in logic and memory devices. Investigated solder / metallization reactions, conducted alpha-particle emission spectroscopy, and developed creep and fatigue resistant Pb-based solder alloys with IBM Federal Systems Division. Assisted in coordinating team efforts for 30+ step integration process and developed processes for wet and dry thin film etching through collaboration with IBM Research Division. Primary technical responsibilities included mechanical testing, electrical testing, reflow processing, and physical characterization of insulator - thin film metallization - solder structures. Show less Developed controlled collapse chip connection (C4) processes for high density microelectronic interconnection in logic and memory devices. Investigated solder / metallization reactions, conducted alpha-particle emission spectroscopy, and developed creep and fatigue resistant Pb-based solder alloys with IBM Federal Systems Division. Assisted in coordinating team efforts for 30+ step integration process and developed processes for wet and dry thin film etching through collaboration with IBM… Show more Developed controlled collapse chip connection (C4) processes for high density microelectronic interconnection in logic and memory devices. Investigated solder / metallization reactions, conducted alpha-particle emission spectroscopy, and developed creep and fatigue resistant Pb-based solder alloys with IBM Federal Systems Division. Assisted in coordinating team efforts for 30+ step integration process and developed processes for wet and dry thin film etching through collaboration with IBM Research Division. Primary technical responsibilities included mechanical testing, electrical testing, reflow processing, and physical characterization of insulator - thin film metallization - solder structures. Show less