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5.0

/5.0
/ Based on 2 ratings
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Mark Harrand

Jeff Koeppel is an experienced and resourceful engineer with a broad range of mechanical and thermal design skills. He has designed unique and complex systems, from supercomputer chassis to individual server modules. These include exotic, custom-designed platforms for airborne military/intelligence applications. The systems required innovative electrical, mechanical, and thermal features to meet demanding specifications. In addition to his design and analytical skills, Jeff is a hands-on engineer, equally at home in the production line, shop, or test lab. As a fellow engineer and manufacturing manager, I depend on the quality of his work and admire how he can pull together a design with limited resources. I have worked with Jeff for over 20 years at several companies on many successful projects. He is easy to work with and stays calm under pressure. I am happy to recommend him for any senior engineering or engineering management position.

Jon Huppenthal

Jeff has been part of my engineering team for over 20 years and at three companies. Through that time he has consistently developed inovative solutions to a variety of mechanical and thermal challenges. Jeff is a self starter who works as well as an individual contributor or as part of a larger team. I do not hesitate to give Jeff any assignment that comes up.

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Experience

    • United States
    • Research Services
    • 100 - 200 Employee
    • Mechanical Design Section Head
      • Apr 2020 - Present

    • Senior Mechanical Engineer
      • Feb 2020 - Apr 2020

    • Senior Mechanical Engineer
      • Aug 2001 - Jan 2020

      * Principle Mechanical Engineer providing 99% of Product Design and electronic packaging for SRC Computers. Designed Patent Pending memory cooling device. * My role requires me to cover all aspects of new Product Development. I'm a "hands on" engineer responsible for prototype design and build, all documentation and training, and manufacturing support. I'm experienced in prototype parts fabrication for tooling, and proof of concept ideas. * Leading edge packaging and cooling of electronics utilizing air and liquid cooling techniques. Product designs for 19" rack mount Servers, Airborne Systems and Ground Stations. * Over 20 years of experience with thermal and stress analysis. * Tooling Design and direct interaction with manufacturing to enable smooth transition from design to build. * System level design to meet Shock, Vibration, Environmental standards of MIL-STD-810, MIL-STD-648, MIL-STD-210 and RTCA/DO-160. * System level design to meet EMI/EMC standards of MIL-STD-461, MIL-STD-464, RTCA-DO-160, FCC Class A and B. * Hands-on engineer with experience in prototype fabrication of parts, training production personnel and interfacing with suppliers. Show less

    • United States
    • Semiconductor Manufacturing
    • 700 & Above Employee
    • Manager, Mechanical Engineering
      • May 1995 - Aug 2001

      * Managed Mechanical Design, PCB Design, Product Documentation and Prototype Fabrication Shop for RF Product Design. * Project Manager for new design of 3 Tesla MRI Amplifier for Fortune 100 company in Medical Equipment Business. * Primary Mechanical Engineer for packaging and cooling high power RF products. * Provided monthly design reviews and project updates to Corporate VP of Engineering. Traveled to customer facilities for design reviews and provided field service assistance. * Managed Mechanical Design, PCB Design, Product Documentation and Prototype Fabrication Shop for RF Product Design. * Project Manager for new design of 3 Tesla MRI Amplifier for Fortune 100 company in Medical Equipment Business. * Primary Mechanical Engineer for packaging and cooling high power RF products. * Provided monthly design reviews and project updates to Corporate VP of Engineering. Traveled to customer facilities for design reviews and provided field service assistance.

    • Mechanical Engineer
      • Apr 1990 - Mar 1995

      * Design of High Precision robotic equipment to facilitate assembly of computer modules. Designed systems for: Wire handling machine to shape and cut 5 mil stranded wire, laser cutting and automated soldering. * Product design for Cray 3 and Cray 4 product lines. Key member of redesigning immersion cooling to simplify system. * Primary Engineer for packaging control electronics and system chassis. * Design of High Precision robotic equipment to facilitate assembly of computer modules. Designed systems for: Wire handling machine to shape and cut 5 mil stranded wire, laser cutting and automated soldering. * Product design for Cray 3 and Cray 4 product lines. Key member of redesigning immersion cooling to simplify system. * Primary Engineer for packaging control electronics and system chassis.

Education

  • University of California, San Diego
    BSME, Mechanical Engineering

Community

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