Experience

Kyocera International, Inc. - Semiconductor Components Group

• United States
• Semiconductor Manufacturing
• 1 - 100 Employee

• Project Manager

  • Jan 2006 - Present

  • Project Manager for Advanced Products Division • LTCC Process Engineer • Responsible for LTCC green processes • Proficient in LTCC assembly; setting up processes and reflow profiles • Sole person responsible for embedded LTCC and surface requirements • Experienced in writing work instructions • Skilled in all areas of reworking • Effective at defect loss reduction and yield improvement programs • New product development, characterizing new materials and processes to advance LTCC technology Show less



N

• United States
• Appliances, Electrical, and Electronics Manufacturing
• 1 - 100 Employee

• Process Engineer

  • Nov 2003 - Dec 2005

  • LTCC Engineering Manager • Proto-type Manager • Established AlN material set which resulted in quick turn qualification for Raytheon HTM-4 and became an alternative technology development for Natel Engineering • Assembly experience included Kovar, Cu/Mo/Cu seal rings, heat sinks, lead attach, tab attach, pedestal attach, and the attachment of multiple connectors • Expert in LTCC processes including tape blanking, tape stabilization, via punching, cavity punching, via filling, conductor printing, resistor printing, collating, lamination, co-firing, post printing • Created firing profiles for both co-fired and post fired LTCC and Thick Film Cu (Nitrogen) and air fired metallization • Specialist with embedded resistor requirements for LTCC and surface Thick Film resistors • Created and implemented production processes, generated work instruction documentation, characterized materials and equipment • Was responsible for writing FMEA’s, Control Plans, Quality Test Plans and Production Travelers • Effective customer interaction Show less



Scrantom Engineering Inc

• United States
• Industrial Machinery Manufacturing

• Process Engineer

  • Jan 1993 - Nov 2003

  • Positions held: Process Engineering Manager, Process Engineer, Project Manager • Recruited and trained personnel for Operator, Technician and Engineering positions • Managed 4 Process Engineers and 3 Technicians • Accountable for Proto-type and Pilot production builds • Managed Production scheduling, Production Yield improvement, Defect Loss reduction • Expert in LTCC processes including tape blanking, tape stabilization, via punching, cavity punching, via filling, conductor printing, resistor printing, collating, lamination, co-firing, post printing • Specialist with embedded resistor requirements for LTCC and surface Thick Film resistors. • Programmed electrical test and was proficient to analyze and determine electrical test failures • Created firing profiles for both co-fired and post fired LTCC and Thick Film Cu (Nitrogen) and air fired metallization • Veteran with assembly using Au/Sn, Au/Ge and Pb/Sn solders. • Assembly experience included Kovar, Cu/Mo/Cu seal rings, heat sinks, lead attach, tab attach, pedestal attach, and the attachment of multiple connectors • Proficient with various Mil-Std documentation • Thick Film Processor for single layer, multi-layer and double sided circuit processing • Expert with Au, Pt, Pd, PtPd, PdAg, Dielectric, Cu printing • Worked thoroughly with Raytheon on HTM-4 program which utilized 3 separate LTCC assemblies with embedded resistors and flange assembly • Developed critical processes for Boeing Space Way program which resulted in Scrantom Engineering being the prime LTCC contractor for this program • Created and implemented production processes, generated work instruction documentation, characterized materials and equipment • Designed proprietary materials compatible with DuPont and Ferro LTCC systems • Was responsible for writing FMEA’s, Control Plans, Quality Test Plans and Production Travelers • Author and Co-author of several trade papers published through IMAPS • Strong customer interface Show less



International Hybrid Corporation

• Santa Ana, Ca. 92735

• Thick Film Techinician

  • 1991 - 1992

  • Proto-type Technician developing Thick Film processes for offshore facility • Design proof of concept responsibility and manufacturing readiness capability from inception to pilot production build completion • Thick Film Processor for single layer, multi-layer and double sided circuit processing • Specialist in Resistor printing • Experience with Au, Pt, Pd, PtPd, PdAg, Dielectric Printing • Established firing profiles and preserved charted processes • Worked with Alumina and BeO Show less



McDonnell Douglas

• Huntington Beach, CA. 92647

• Senior Development Assistant

  • 1988 - 1991

  • Lead Technician in Gallium Arsenide Wafer Fab • Single Engineering Technician for Delta Thick Film Resistor Networks (Printing, Firing and Abrasive Resistor Trimming) • Thick Film Processor for Mast Mounted Site (Multi-layer Au Thick Film Circuitry) • Furnace profiling • Trained in LTCC (Low Temperature Cofire Ceramics) preparing ceramic slurry, tape casting, became knowledgeable in tape blanking, via punching, via filling, layer printing, lamination, firing. • Lead Technician in Gallium Arsenide Wafer Fab • Single Engineering Technician for Delta Thick Film Resistor Networks (Printing, Firing and Abrasive Resistor Trimming) • Thick Film Processor for Mast Mounted Site (Multi-layer Au Thick Film Circuitry) • Furnace profiling • Trained in LTCC (Low Temperature Cofire Ceramics) preparing ceramic slurry, tape casting, became knowledgeable in tape blanking, via punching, via filling, layer printing, lamination, firing.



Vitarel Microelectronics

• Appliances, Electrical, and Electronics Manufacturing

• Thick Film Technician / Supervisor

  • 1986 - 1988

  • Thick Film Circuit Fabrication • Single layer, Multi-layer and double sided processing • Plated-thru vias, solid filled vias • Experience with Au, Pt, Pd, PtPd, PdAg, Dielectric Printing • Specialist in Resistor printing from 1Ω to 10MΩ values • Worked with Alumina and BeO • Controlled manufacturing processes in high production industrialized facility • Managed and trained 19 production operators • Developed 2nd shift production capability to meet high demand requirements • Increased production yields and decreased manufacturing costs by reducing defect loss and optimizing operator output Show less



Integrated Networks Inc.

• Technician

  • 1983 - 1986