Experience

Kulicke & Soffa

• Singapore
• Semiconductor Manufacturing
• 700 & Above Employee

• Wire Bonding Application Team Lead

  • 2014 - Present

  Summary: • Extensive knowledge on wire bonding process application - Au, Cu and Ag wire • Technical knowledge on Product Development Plan (PDP) for new IC packaging and technology, processes, and reliability requirement. • Knowledge and application of Minitab Statistical software. • Inventor/co-inventor of 21 Packaging solution and concept. Current Role & Responsibility: • Plan, coordinate and lead a team of Application Engineers to successfully conduct customer buyoffs and acceptance of KNS equipment. • Provide technical lead to all issues affecting wire bonder process development. • Negotiate, check, verify and finalize customer’s requirements and specifications. • Manage Customer Projects to ensure on-time machine shipments. • Keep team up to date on wire bonding technology. Show less



Heraeus Materials Singapore Pte Ltd

• 1 - 100 Employee

• Senior Application Engineer

  • Feb 2013 - May 2014

  R&D Wire development application engineer Achievements and Innovations • Development/ co-inventor for new Cu wire with improve 2nd bond and reliability • 2nd source wire qualification in FSKL R&D Wire development application engineer Achievements and Innovations • Development/ co-inventor for new Cu wire with improve 2nd bond and reliability • 2nd source wire qualification in FSKL



Microbonds Inc.

• Nanotechnology Research
• 1 - 100 Employee

• Staff Application Engineer

  • Nov 2008 - Mar 2012

  Product Application Support in Asia Customer Achievements and Innovations: • Development and Evaluation of Direct Pd Coated Cu and Pd Coated Silver • Co-contributor of IMAPS 2010 Technical Paper- Wire Bonding UPH & Stitch Bond Improvement using 20um Insulated Wire with Security Bump • Insulated Cu Wire Bondability Optimization • Qualification of X-wire in UTAC • Qualification of X-wire in DFN & QFN package in Linear Technology Product Application Support in Asia Customer Achievements and Innovations: • Development and Evaluation of Direct Pd Coated Cu and Pd Coated Silver • Co-contributor of IMAPS 2010 Technical Paper- Wire Bonding UPH & Stitch Bond Improvement using 20um Insulated Wire with Security Bump • Insulated Cu Wire Bondability Optimization • Qualification of X-wire in UTAC • Qualification of X-wire in DFN & QFN package in Linear Technology



JCET Group

• China
• Semiconductor Manufacturing
• 700 & Above Employee

• Senior IC Packaging Engineer

  • Jun 2006 - Oct 2008

  New IC package design & process development Achievements and Innovations: • Development and Evaluation of Direct Pd Coated Cu and Pd Coated Silver • Looping Development for 4 die side by side, MTK Sydney device • Cu wire process development, 2008 • Inventor/co-inventor of 21 Packaging Solution Patent • UQFNs-se Dialog – LVM, July 2008 • VQFNp-dr Intel Kedron – HVM, Jan 2007 • Bond on Trace (BOT) wirebond process • Pro-stitch process for UQFNs-COL • 2nd Bond process on ENEPIG Show less