Experience

Dowcorning

• China
• Chemical Manufacturing
• 1 - 100 Employee

• Application Engineer Specialist

  • Sep 2012 - Present



Parker Hannifin

• United States
• Industrial Machinery Manufacturing
• 700 & Above Employee

• Senior Applications Engineer

  • Oct 2010 - Oct 2012

  • Focus on all EMI and thermal products application in South China and coordinates with AP technology team to solve critical products, applications, design and quality issues met. Provide oral, written solutions to customers. Design in new products in new projects of customers.• Provide on-site and direct support to Key customers in South China. Handle all technologies issues between customer and company. Most customers are telecom, automotive, IT etc. Provide detailed solutions. Key… • Focus on all EMI and thermal products application in South China and coordinates with AP technology team to solve critical products, applications, design and quality issues met. Provide oral, written solutions to customers. Design in new products in new projects of customers.• Provide on-site and direct support to Key customers in South China. Handle all technologies issues between customer and company. Most customers are telecom, automotive, IT etc. Provide detailed solutions. Key customers include Huawei, ZTE, Newpostcom, Finisar, Bosh, Foxconn, Alu, Ericsson, NSN, Tyco, etc.• Setup Applications Lab in Shenzhen and manage its operations to support customer’s custom applications and testing requirements. Generate report and technical presentations.• Present new launched products to key customers and distributors in AP. Organizing and leading Boot camp training for AP distributors.• Direct and carry out research and development efforts for new products required by market. Generate internal technology language for new market requirements and feedback to RD dept. Act as a key contact window between internal technology team and customer engineering.Here, My major technology area is related to EMI and thermal materials application and design. Through these two years working experience, I have gained more EMI and thermal applications experience and knowledge. Based on thermal experience before, more knowledge and skills have been learned. Do full-scale design and solutions to avoid EMI and thermal problems in electronics products. Show more Show less



Laird

• 2009

  • Jun 2009 - Sep 2010

  • Act as a senior application engineer and Work in a research and development environment. Manage all the products development, such as thermal grease, thermal gap pad, thermal tape, adhesive, thermal sil-pad, thermal gap filling material, phase change material, EMI silicone rubber, Thermal conductive PCB etc. Familiar with silicone material and other kinds of polymers such as epoxy, UR, Acrylic etc• Give a great technical support to Japan customers, such as Shinko, Panasonic etc, help… • Act as a senior application engineer and Work in a research and development environment. Manage all the products development, such as thermal grease, thermal gap pad, thermal tape, adhesive, thermal sil-pad, thermal gap filling material, phase change material, EMI silicone rubber, Thermal conductive PCB etc. Familiar with silicone material and other kinds of polymers such as epoxy, UR, Acrylic etc• Give a great technical support to Japan customers, such as Shinko, Panasonic etc, help sales win more business in TIM area.• Offer total TIM application and test solution to south China key customers, such as Huawei, ZTE, Delta, Emerson, Coolermaster, AVC, Foxconn, etc. keep good relationship with customers. Help to win more business in Huawei, ZTE, Emerson. Products include gap pad, insulators and grease, Thermal bond tape etc.• In daily works, Plan, schedule, and conduct work requiring judgment in the independent evaluation, selection, and adaptation of scientific techniques, procedures, and approaches.• Direct and carry out research and development efforts. Demonstrate technical excellence and technical leadership by presenting papers, Attend some technical conferences; meet with customers and offer total TIM’s solution, Focus on the application of the scientific method to specific technical problems and challenges encountered by Factory products.During my applications engineer periods, I gained experience of thermal interface materials design and application from different area customers. Familiar with thermal design rules and standard test methods for different kinds of TIMs. Show more Show less



Huawei Technologies

• United Kingdom
• Telecommunications
• 200 - 300 Employee

• RD Engineer and Project Leader

  • Jun 2005 - Jun 2009

  • Finish the evaluating and application project of phase change materials. Through evaluating the phase change materials from Chomerics, Bergquist, Loctite, Dowcorning and Larid, I finished design and testing of PCMs and made several different design solutions for the products. Give a good solution for 40G and 20G optics modules thermal problems.• Research and develop a printable heatsink paste used on PCBA.• With the application of printable heatsink on the PCBA, the temperature of… • Finish the evaluating and application project of phase change materials. Through evaluating the phase change materials from Chomerics, Bergquist, Loctite, Dowcorning and Larid, I finished design and testing of PCMs and made several different design solutions for the products. Give a good solution for 40G and 20G optics modules thermal problems.• Research and develop a printable heatsink paste used on PCBA.• With the application of printable heatsink on the PCBA, the temperature of board can be reduced about 6 degrees.• Finish the evaluation and selection of gap pad for wireless base station products. Familiar with gap pads performance and application from Bergquist, Fujipoly, Laird and Dowcorning, 3M etc.• Since 2007, Act as thermal interface materials project Leader. Manage the design, selection and application of different types thermal interface materials. Set new materials design roadmap in thermal technical managing group. Set and update new design standards of thermal interface materials in Huawei. Offer design support to product design engineer and help them have a perfect application of thermal interface materials.• Build the evaluating, reliability, selection and application platforms in Huawei. Through attending PCB projects, solder paste materials projects. Have gained wide experiences in most electronics materials. Have a good background in PCB materials, solder paste, solder mask and other electronics materials. In Huawei, I have a deep understanding of the application of thermal materials， SMT materials and EMI materials. And have passed GB training and PMP training. Familiar with project managing and the systemic product developing process(IPD). Very familiar with the properties of materials from 3M, PPI, Lord, Henkel, Chomerics, Bergquist, Dowcoring, Shinetsu and Larid. Know the trend of Customer’s requirements and the products Development. Show more Show less