Jack Grenfell

Director Of Hardware Engineering at ID TECH
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Contact Information
us****@****om
(386) 825-5501
Location
Rocklin, California, United States, US

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Experience

    • United States
    • Appliances, Electrical, and Electronics Manufacturing
    • 100 - 200 Employee
    • Director Of Hardware Engineering
      • Aug 2019 - Present

      500 Menlo Drive, Rocklin, CA Development of Point of Sales Terminals

    • United States
    • Financial Services
    • 700 & Above Employee
    • Hardware System Architect
      • May 2012 - Jun 2019

      1400 W. Stanford Ranch Rd., Suite 200, Rocklin, CA 95765-3750 As a Hardware System Architect, I am responsible for developing the new architectures used in Verifone's Point-of-Sale (POS) equipment. This architecture transitioned Verifone from the 400MHz custom ARM-1136JF-S SoC to a 1GHz ARM Cortex A9 SoC to achieve a high level of physical and logical security integration as well as integrating key POS peripheral functionality. In addition to the VF2111 SoC, a VF1111 Power Management/Backup Power Supervisor IC, and a VF6111 Smart Card PHY were also… Show more As a Hardware System Architect, I am responsible for developing the new architectures used in Verifone's Point-of-Sale (POS) equipment. This architecture transitioned Verifone from the 400MHz custom ARM-1136JF-S SoC to a 1GHz ARM Cortex A9 SoC to achieve a high level of physical and logical security integration as well as integrating key POS peripheral functionality. In addition to the VF2111 SoC, a VF1111 Power Management/Backup Power Supervisor IC, and a VF6111 Smart Card PHY were also defined and developed. My responsibilities in this position are to; * Select and work closely with chip vendors to define and develop the Raptor chipset. * Create a Complete POS System Reference Design Platform for the O/S and App Developers. * Integrate Qualcomm-based module to support LCD, Audio, and Camera for Android products. * Assist the Product Design Centers in the U.S., Taiwan, and Singapore with product development. * Provide architecture knowledge to product design engineers, and product marketing managers. * Create Reference Designs with Cadence OrCAD Schematic Capture and Allegro PCB Editor. * Provide Functional Block Bill of Material Breakdowns for Product Cost / Benefit Trade-offs. * Provide Engineering support during bring-up / debug of Development Platform and PCBAs. * Provide schematics and reference layouts that address ESD/EMC and signal integrity issues. * Provide knowledge of embedded systems using ARM Cortex SOCs, SLC NAND, and LPDDR2. * Provide knowledge of communication ports using I2C, I2S, UART, SPI, SDIO, RMII, and USB. * Provide knowledge of functional blocks such as Li-ion Batteries, Chargers, and Fuel Gauges. * Provide knowledge of Magnetic, Contact, and Contactless payment peripherals. * Work with my approved part vendors to lower costs for a savings of over $4.1M/year. * Received patent US9208361 B1 for magnetic stripe reader noise cancellation method. * Be a Tiger-team member responsible for investigating and solving challenging technical issues.

    • Principal Hardware Engineer
      • May 2007 - May 2012

      1400 W. Stanford Ranch Rd., Suite 200, Rocklin, CA 95765-3750 I was the Principal Hardware Engineer assigned to work on the new Trident Architecture as a project lead. This architecture transitioned Verifone from the 200MHz ARM-920T SoC to a 400MHz custom ARM-1136JF-S SoC to achieve a high level of physical and logical security integration as well as integrating key POS peripheral functionality. In addition to the VF2101 SoC, a VF1101 Power Management IC, VF8101 Backup Power Supervisor, and VF6101 Smart Card PHY were defined and developed allowing us to… Show more I was the Principal Hardware Engineer assigned to work on the new Trident Architecture as a project lead. This architecture transitioned Verifone from the 200MHz ARM-920T SoC to a 400MHz custom ARM-1136JF-S SoC to achieve a high level of physical and logical security integration as well as integrating key POS peripheral functionality. In addition to the VF2101 SoC, a VF1101 Power Management IC, VF8101 Backup Power Supervisor, and VF6101 Smart Card PHY were defined and developed allowing us to produce low cost, high performance, small form factor product designs, with enhanced security. On-going sales volumes are on track to far exceed the Predator sales records. My responsibilities in this position were to; * Select and work closely with chip vendors to define and develop the Trident chipset. * Create a Complete POS System Reference Design Platform for the O/S and App Developers. * Assist the Product Design Centers in the U.S., Taiwan, and Singapore with product development. * Generate Product Reference Design Schematics using Cadence OrCAD Schematic Capture. * Provide guidance to PCB Designer on recommended component placement and routing. * Provide Functional Block Bill of Material Breakdowns for Product Cost / Benefit Trade-offs. * Provide Engineering support during initial bring-up / debug of Development Platform and PCBAs. * Provide schematics and reference layouts that address ESD/EMI/RFI and signal integrity issues. * Provide knowledge of embedded systems using ARM SOCs, SLC NAND, and LPDDR. * Provide knowledge of communication ports using I2C, I2S, UART, SPI, SDIO, RMII, and USB. * Provide knowledge of functional blocks such as PMICs, Li-ion Batteries, and Security circuits. * Work with my approved component vendors to lower costs for a savings of over $4.3M/year. * Co-develop and submit patent (US 2013/0225075) for improved NFC operation through LCD. * Be a Tiger-team member responsible for investigating and solving challenging technical issues.

    • Senior Electrical Design Engineer
      • Mar 2002 - May 2007

      3755 Atherton Road, Rocklin, CA 95765 Upon being rehired at Verifone, I was the Sr. Electrical Design Engineer assigned to work on the new Predator Architecture as a project lead. The Predator Architecture transitioned Verifone from the 15MHz Motorola 68302 to the 200MHz Samsung ARM-920T SoC to achieve low cost, high performance, smaller form factor product designs. My responsibilities in this position were to; * Select and work closely with chip vendors to define and develop a custom Security IC. * Create a Reference… Show more Upon being rehired at Verifone, I was the Sr. Electrical Design Engineer assigned to work on the new Predator Architecture as a project lead. The Predator Architecture transitioned Verifone from the 15MHz Motorola 68302 to the 200MHz Samsung ARM-920T SoC to achieve low cost, high performance, smaller form factor product designs. My responsibilities in this position were to; * Select and work closely with chip vendors to define and develop a custom Security IC. * Create a Reference Design Platform for use by the O/S and Application Software Developers. * Design a market-changing Countertop POS terminal with a lifetime sales of 8 million units. * Design the world’s smallest Portable POS terminal with a lifetime sales of 4 million units. * Provide architecture knowledge to product design engineers, and product marketing managers. * Generate Product Reference Design Schematics using Zuken Schematic Capture. * Provide guidance to PCB Designer on recommended component placement and routing. * Provide Functional Block Bill of Material Breakdowns for Product Cost / Benefit Trade-offs. * Provide Engineering support during initial bring-up / debug of Development Platform and PCBAs. * Provide schematics and reference layouts that address ESD/EMI/RFI and signal integrity issues. * Provide knowledge of embedded systems using ARM SOCs, NOR FLASH, and SRAM. * Provide knowledge of communication ports using I2C, RS-232/RS-485, MODEM, and USB. * Provide knowledge of functional blocks such as MSR, LCDs, Printers, and Security circuits. * Work with my approved component vendors to lower costs for a savings of over $2.7M/year. * Co-develop and patent (#7,878,397) an enhanced security magnetic stripe reader.

    • Consultant
      • Jan 2002 - Mar 2002

      Livermore, California Responsible for programming an Allen Bradley PLC in ladder logic to control all laser, DI water flow, motion control, and other sub-module safety interlocks. I was granted security clearance to perform the programming work at the Lawrence Livermore National Lab (LLNL) under contract with the Metal Improvement Company for a Wright-Patterson Air Force Base project to develop laser peening technology for large jet engine turbine blades.

    • Consultant
      • Dec 2001 - Jan 2002

      Roseville, CA Responsible for selecting components, creating schematics in Protel, and generating Bill of Materials for a NEBS compliant VoIP network.

    • United States
    • Financial Services
    • 700 & Above Employee
    • Senior Electrical Design Engineer
      • Jun 1998 - Oct 2001

      3755 Atherton Road, Rocklin, CA 95765 During this time, Verifone was owned by Hewlett Packard (HP) and I was the Sr. Electrical Design Engineer assigned to work on the new Portable Point-of-Sale (POS) products and refresh the design of an existing product. My responsibilities in this position were to; * Design a fully automatic "Quad" Li-ion Battery Charger for use with the Portable Products. * Engage with AC/DC Power Adapter vendor to create a low-cost, world-wide power adapter. * Co-develop and patent (#6,646,565)… Show more During this time, Verifone was owned by Hewlett Packard (HP) and I was the Sr. Electrical Design Engineer assigned to work on the new Portable Point-of-Sale (POS) products and refresh the design of an existing product. My responsibilities in this position were to; * Design a fully automatic "Quad" Li-ion Battery Charger for use with the Portable Products. * Engage with AC/DC Power Adapter vendor to create a low-cost, world-wide power adapter. * Co-develop and patent (#6,646,565) a security module to prevent access to encryption keys. * Design an automated, security module, test fixture to be used by our contract manufacturers. * Refresh an existing terminal to solve EOL issues and meet latest PCI security standards. * Solve EOL issue by having vendor integrate Driver into VF-Display for a savings of $146.5K/year. * Work with my approved component vendors to lower costs for a savings of over $313K/year. * Ensure POS terminals passed encryption key erasure testing and ESD/EMI certifications. * Design a high-efficiency, switching power supply for a battery powered, wireless POS terminal. * Provide electrical engineering support during initial bring-up / debug of early life cycle PCBAs. Show less

    • United States
    • Semiconductor Manufacturing
    • 100 - 200 Employee
    • Project Lead - Electrical Engineering
      • May 1996 - Jun 1998

      3825 Atherton Road, Rocklin, CA 95765 At Intevac, I was the Principal Electronics Engineer responsible for the development of a prototype Laser Texturing System (LTS) designed to texture the annular landing zones of aluminum hard drive disks with a multitude of non-ablated aluminum dimples of 2000 angstroms, +/- 200 angstroms. My responsibilities in this position were to; * Design the AC and DC power distribution systems for the Nd:YAG laser and hard disc handlers. * Design the stepper motor motion control system for… Show more At Intevac, I was the Principal Electronics Engineer responsible for the development of a prototype Laser Texturing System (LTS) designed to texture the annular landing zones of aluminum hard drive disks with a multitude of non-ablated aluminum dimples of 2000 angstroms, +/- 200 angstroms. My responsibilities in this position were to; * Design the AC and DC power distribution systems for the Nd:YAG laser and hard disc handlers. * Design the stepper motor motion control system for the hard disc elevator and spindle motors. * Design the motion and laser beam safety interlocks using mechanical and optical sensors. * Design an ISA-bus based laser firing board (LFB) using a 20MHz, 80C166 microcontroller. * Design the control interface to a Class-4 Nd:YAG laser to generate the laser-firing control signals. * Design a high-speed quadrature detector circuit for use with a 4 arc-second encoder. * Write an interrupt driven, embedded software program for the LFB in both "C" and assembler. * Write software program for the RS-232 interface to the Laser Power Supply and remote terminal. * Utilize a Phase-Shift Interferometric Microscope at LLNL, in Livermore, CA, to verify results.

    • Program Manager - Arc Lamp Development
      • May 1994 - May 1996

      3825 Atherton Road, Rocklin, CA 95765 At Intevac, as a continuation of my Arc Lamp and Arc Lamp Power Controller development work, I was the Program Manager responsible for submitting and receiving an award for $540,000 from the Advanced Research Projects Agency (ARPA) to design and develop a long-arc plasma discharge lamp for Intevac's Flat Panel Display Rapid Thermal Processor (FPD-RTP). I successfully completed the 24 month ARPA project on time and under budget. The result was an increased average lamp life of 730%, and I… Show more At Intevac, as a continuation of my Arc Lamp and Arc Lamp Power Controller development work, I was the Program Manager responsible for submitting and receiving an award for $540,000 from the Advanced Research Projects Agency (ARPA) to design and develop a long-arc plasma discharge lamp for Intevac's Flat Panel Display Rapid Thermal Processor (FPD-RTP). I successfully completed the 24 month ARPA project on time and under budget. The result was an increased average lamp life of 730%, and I presented my results at the High Definition Systems Conference in Washington, DC. My responsibilities in this position were to; * Design and construct three, water-cooled, fully automated, 30KW long-arc lamp test stations. * Design the safety interlock system using thermocouple, water flow, and mechanical sensors. * Program a GE-Fanuc PLC in Ladder Logic to automatically control the lamp test stations. * Create a graphical user interface (GUI) and RS-232 data acquisition logger using GENESIS. * Subcontract the Thermal Modeling and Water Flow Analysis to M.E. Graduate student at CSUS. * Work closely with 2 lamp vendors to optimize the xenon gas fill pressure and electrode design. * Experiment with various electrode materials to produce the most efficient thermionic emission. * Create a mathematical model to determine maximum power based on lamp bore and fill pressure. * Analyze arc lamp spectral output with Oriel Instaspec Spectrograph and Diffraction Grating. * Present my results at the ARPA High Definition Systems Conference in Washington, DC.

    • Senior Electronics Engineer
      • Aug 1990 - May 1994

      3825 Atherton Rd., Rocklin, CA 95765 I was the Senior Electronics Engineer responsible for designing Beta and Production systems of the Flat Panel Display Rapid Thermal Processor (FPD-RTP). The FPD-RTP processed large area (350mm x 450mm) glass panels for use in Flat Panel LCDs by improving the electron mobility and leakage of the silicon coating in which the LCD's thin film transistors (TFT) will later be formed. My responsibilities in this position were to; * Design the electrical systems of the 480VAC, 200A, FPD-RTP… Show more I was the Senior Electronics Engineer responsible for designing Beta and Production systems of the Flat Panel Display Rapid Thermal Processor (FPD-RTP). The FPD-RTP processed large area (350mm x 450mm) glass panels for use in Flat Panel LCDs by improving the electron mobility and leakage of the silicon coating in which the LCD's thin film transistors (TFT) will later be formed. My responsibilities in this position were to; * Design the electrical systems of the 480VAC, 200A, FPD-RTP to meet all safety requirements. * Design the safety interlock system using IR proximity, water flow, and mechanical sensors. * Design the thermal control system for the quartz tube radiant pre-heaters and post-heaters. * Design the servo motor motion control system for the large are glass panel conveyor. * Design a microcontroller based 30KW switching power supply using H-Bridge IGBTs. * Design a low-inductance bus structure for the 650Vdc power bus required to power the arc lamp. * Design a 30KV ignition system required to create the initial plasma inside the arc lamp. * Write program code for a 80C166 microcontroller in "C" to implement dual loop power control. * Write the program code for digital signal processing (DSP) of ADC and DAC I/O. * Integrate and program the MECS large area glass handling robot from input to output cassettes. * Engage with outside testing labs to obtain UL Recognition and Safety approvals. * Travel to Japan to install and calibrate that FPD-RTP system at customer site. * Transfer the FPD-RTP and arc lamp power controller technology to Intevac in May of 1994. Show less

    • Electrical Engineering Lead
      • Feb 1990 - Aug 1990

      48550 Warm Springs Blvd., Fremont, CA 94539 After transferring General Signal - Micro Automation technology to General Signal - Advanced Mechanization in Horsham, PA, I took a position with General Signal - Thinfilm Company where I finalized the design of a Ultra-High Vacuum, Semiconductor Cluster Tool. My responsibilities in this position were to; * Finalize the design of a 480V, 800A, AC power distribution system including all safety interlocks. * Design a 500V, battery powered, electrostatic, silicon wafer chuck to remove… Show more After transferring General Signal - Micro Automation technology to General Signal - Advanced Mechanization in Horsham, PA, I took a position with General Signal - Thinfilm Company where I finalized the design of a Ultra-High Vacuum, Semiconductor Cluster Tool. My responsibilities in this position were to; * Finalize the design of a 480V, 800A, AC power distribution system including all safety interlocks. * Design a 500V, battery powered, electrostatic, silicon wafer chuck to remove mechanical stress. * Design the +250V / -250V, 0.1mA, battery operated power supply to apply virtual 0V to wafer. * Design the phase-locked loop wafer detection scheme utilizing synchronous demodulation. * Design the IR communication link for use through the quartz windows in the vacuum cluster tool. * Prepare the patent application for the electrostatic, silicon wafer chuck. * Design fail-safe controls for toxic gas monitoring and robotic motion emergency shutdown. Show less

    • Electrical Engineer
      • Sep 1984 - Feb 1990

      3055 Coronado Drive, Santa Clara, CA 95054 I was an Electrical Engineer assigned to join the product team that was bringing a new Fully Automated Semiconductor Dicing Saw to the market. As the project progressed, I took on the role of a project lead responsible for a multi-disciplined team of electrical, software, and mechanical engineers. My responsibilities in this position were to; * Debug the electrical and mechanical assemblies and work with the team to resolve the issues. * Train the technicians on the proper… Show more I was an Electrical Engineer assigned to join the product team that was bringing a new Fully Automated Semiconductor Dicing Saw to the market. As the project progressed, I took on the role of a project lead responsible for a multi-disciplined team of electrical, software, and mechanical engineers. My responsibilities in this position were to; * Debug the electrical and mechanical assemblies and work with the team to resolve the issues. * Train the technicians on the proper component and wiring harness assembly techniques. * Design a high-speed, blade-break detector for the water cooled, 30K RPM, dicing saw blade. * Design the signal conditioning for the optical blade-break detect to prevent false detection. * Assist customers to optimize the target selection for the Video Pattern Recognition Unit. * Assist customers with the proper choice of dicing saw parameters and diamond blade selection. * Write the product User Guide, Troubleshooting, and Maintenance Manuals for the product. * Write and appear in a Product Use, Troubleshooting, and Maintenance Video for the product. * Work with Marketing Director to produce a detailed and technically accurate product brochure. * Work with the team to develop a 68020-based video frame grabber for in-situ blade inspection. * Travel to various trade shows in the US, Europe, and Asia to provide product demonstrations. * Travel to various sites in the US and Asia to install the product and train customer personnel. * Transfer the dicing saw technology to General Signal - Advanced Mechanization in Horsham, PA. Show less

    • United States
    • Utilities
    • 700 & Above Employee
    • Member of the Instrumentation Department
      • Dec 1982 - Sep 1984

      6500 North Dresden Road, Morris, IL 60450 Part of a team that was responsible for installation, calibration, and maintenance of process control instrumentation and equipment at a twin 800 Megawatt Nuclear Power Plant.

    • Non-profit Organizations
    • 1 - 100 Employee
    • Volunteer
      • Jun 1980 - Jun 1982

      3490 Lexington Ave. N., St. Paul, MN 55126 A volunteer member of a U.S. concert tour, which provided a Christian music ministry to churches and large youth gatherings.

Education

  • Michigan Technological University
    Bachelor of Science Electrical Engineering Technology
    1978 - 1980
  • Bay de Noc Community College
    Electrical Engineering Transfer Program
    1976 - 1978

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