Experience

Autotalks

• Israel
• Semiconductor Manufacturing
• 1 - 100 Employee

• PTE Expert

  • Jun 2023 - Present



Qualcomm

• United States
• Telecommunications
• 700 & Above Employee

• Principal Engineer. PTE team leader

  • Jul 2014 - Nov 2022

  60GHz RF/BB PTE 5G RF PTE 60GHz RF/BB PTE 5G RF PTE



Wilocity

• Israel

• Senior Product Engineer

  • Jun 2012 - Jul 2014

  • Manage MPW & Full mask tape-out [60/28nm process in TSMC] • Qualify & Bring up of mass production supply chain in the east.[Silicon, bumping, test & Assembly] • Define and implement QA, Planning & production procedures. • Test program management [Debug, TTR, Char] on Teradyne UFlex tester platform. • RMA, FA & customer support • Qualifications and on-going reliability activities [JEDEC] • Wilocity was enquired by Qualcomm • Manage MPW & Full mask tape-out [60/28nm process in TSMC] • Qualify & Bring up of mass production supply chain in the east.[Silicon, bumping, test & Assembly] • Define and implement QA, Planning & production procedures. • Test program management [Debug, TTR, Char] on Teradyne UFlex tester platform. • RMA, FA & customer support • Qualifications and on-going reliability activities [JEDEC] • Wilocity was enquired by Qualcomm



PrimeSense

• VLSI Product Engineer

  • Aug 2010 - May 2012

  • Experienced in Far East operations, working with various vendors Fab, Assembly and Test houses.[SMIC, Amkor, ASE, ATC] – including close management and monthly vendor Audits on site. • Managed an ASIC Vendor team in China. • Yield monitoring. Yield enhancement and SBL procedures Implementation. • Oversee and operated Tape out activities from pre-T/O to mass production. • Experienced in new product qualifications and on-going reliability activities [JEDEC]. • Conducted FAs and PFAs with leading FA houses. • Preformed Characterization of new products using ATE [Verigy 93k] • Managed RMAs and Customer support. • Primesense was enquired by to Apple. Show less



PMC-Sierra is now Microsemi

• Semiconductor Manufacturing
• 300 - 400 Employee

• Product Eng.

  • Aug 2008 - Aug 2010

  • Characterized and validated new products, protocols and IPs in the FTTH and Wireline Infrastructures. • Wrote test programs and used advanced lab equipment to accumulate and analyze the data. • Worked with VLSI and software groups in order to solve technical issues. • Continued supporting the product till RTP and beyond. • Characterized and validated new products, protocols and IPs in the FTTH and Wireline Infrastructures. • Wrote test programs and used advanced lab equipment to accumulate and analyze the data. • Worked with VLSI and software groups in order to solve technical issues. • Continued supporting the product till RTP and beyond.



Tower semiconductor

• Program Manager

  • Feb 2005 - Aug 2008

  • Managed customer support from the design phase to the product is released to mass production and beyond. • Interfaced with design, process, test and reliability teams to solve technical issues and yield enhancement. • Coordinated between the customer and the Fab on all aspects. • Managed customer support from the design phase to the product is released to mass production and beyond. • Interfaced with design, process, test and reliability teams to solve technical issues and yield enhancement. • Coordinated between the customer and the Fab on all aspects.



Semiconductor Industry

• Semiconductor Manufacturing
• 100 - 200 Employee

• Test Engineer

  • 2002 - 2005

  • Involved in FLASH- NVM and CIS projects. • Led program Developments and customer support. • Experience in R&D and Mass production. • Involved in FLASH- NVM and CIS projects. • Led program Developments and customer support. • Experience in R&D and Mass production.