Hsiao-Ting Tsai
Process Engineer at 景碩科技股份有限公司- Claim this Profile
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英文 Limited working proficiency
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中文 Native or bilingual proficiency
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Bio
Experience
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Kinsus Interconnect Technology Corp.
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Taiwan
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Semiconductor Manufacturing
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200 - 300 Employee
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Process Engineer
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Sep 2018 - Present
Mechanic process improvement of IC substrates, including simplifying operation steps, reduction of time costs, and improve the precision of dimension. Accomplishments: ● Managed panel-design and operation rule of routing process. ● Defined SOP, OCAP and built check-in notification of MES (Manufacturing Execution System) to reduce frequency of artificial miss-operation. ● Improved tooling-hole routing precision of SIP-substrates, tighten the dimension range from +/- 50um to +/- 25um. ● Reduced production time of ABF-substrates about 40~50% during routing(from 30~40 min/lot to 15~20 min/lot). ● Added second-source of router bits, reduced production costs by NT$ 1,500,000/Year. Show less
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Education
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2015 - 2017
國立台灣海洋大學
Master's degree, Harbor and river Engineering -
2011 - 2015
國立台灣海洋大學
Bachelor's degree, Harbor and river Engineering
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