Experience

Xidas Inc.

• United States
• Medical Equipment Manufacturing
• 1 - 100 Employee

• Senior Research Engineer

  • Aug 2019 - Dec 2021

  Irvine 1. Project lead of copper nanowire (CuNW) bump and tungsten (W) interposer projects. 2. Performed designed of experiments (DOE) to resolve heterogeneous integration and fabrication issues. 3. Developed unconventional processes: asymmetrical through via interposer, laminated dielectrophoresis (DEP) cell sorting channel, metallic nanowire pillars, Pt stud bumping, Au wire bonding on Al, electroless plating on insulating materials, etc. 4. Tool and process owner: wire bonding, laser… Show more 1. Project lead of copper nanowire (CuNW) bump and tungsten (W) interposer projects. 2. Performed designed of experiments (DOE) to resolve heterogeneous integration and fabrication issues. 3. Developed unconventional processes: asymmetrical through via interposer, laminated dielectrophoresis (DEP) cell sorting channel, metallic nanowire pillars, Pt stud bumping, Au wire bonding on Al, electroless plating on insulating materials, etc. 4. Tool and process owner: wire bonding, laser cutting, electro-chemical deposition, chemical etching, etc. 5. Drafted manufacturing environmental safety and company-wide public health policies and regulations during the period of CoViD-19 pandemic. 6. Executed environmental, health, and safety training during CoViD-19 pandemic based on some fundamental studies in masks, viral persistence on various material, and information/data collection from professional medical authorities.

• Microelectronic Packaging Engineer

  • Jun 2019 - Aug 2019

  Irvine



Skyworks Solutions, Inc.

• United States
• Semiconductor Manufacturing
• 700 & Above Employee

• Microchip Packaging Development Intern

  • Jan 2018 - Dec 2018

  Irvine



UC Irvine

• United States
• Higher Education
• 700 & Above Employee

• Graduate Researcher

  • Jul 2013 - Dec 2018

  Irvine 1. Worked in class 100 cleanroom environment conducting micro and nanofabrication for various projects. 2. Proposed and provided 2.5/3D packaging solution with porous anodic aluminum oxide (AAO) interposer. 3. Developed processes to fabricate AAO MEMs structures. 4. Fabricated high interconnect density through vias exploiting anisotropic characteristic of AAO by wet etching. 5. Implemented and integrated semiconductor fabrication techniques such as PVD, PECVD, dry etching… Show more 1. Worked in class 100 cleanroom environment conducting micro and nanofabrication for various projects. 2. Proposed and provided 2.5/3D packaging solution with porous anodic aluminum oxide (AAO) interposer. 3. Developed processes to fabricate AAO MEMs structures. 4. Fabricated high interconnect density through vias exploiting anisotropic characteristic of AAO by wet etching. 5. Implemented and integrated semiconductor fabrication techniques such as PVD, PECVD, dry etching, electroless plating, electroplating, and CMP to fabricate and embed integrated passive devices (IPD) in AAO interposer. 6. Characterized AAO film and embedded passive devices in AAO with DC Testing, VNA, SEM, chemical etch, etc. 7. Presented high quality factor (Q) and low insertion loss from RF performance analysis of embedded solenoid inductors and coplanar waveguide (CPW) in AAO. 8. Led multidiscipline design of experiments (DOE) in completion of fabrication, simulation, and characterizations.

• Teaching Assistant

  • Sep 2017 - Dec 2017

  -EECS 179 Micro-Electro-Mechanical Systems (MEMs)



Tower Semiconductor

• Israel
• Semiconductor Manufacturing
• 700 & Above Employee

• Failure Analysis Engineer

  • Apr 2011 - Jun 2013

  Newport Beach



National Taipei University of Technology

• Taiwan
• Higher Education
• 400 - 500 Employee

• Research Assistant

  • Jun 2007 - Jun 2008

  Taipei City, Taiwan