Experience

Kinsus Interconnect Technology Corp.

• Taiwan
• Semiconductor Manufacturing
• 200 - 300 Employee

• Senior Sales Manager

  • Aug 2022 - Present

  -FC Sales Department Manager for top tier end customers on FPGA, GPU, & Processor-Coordinate CRA and coordinate K5/K6 New Factory Bring up from -Responsible for~$450M/year business revenue and also becoming one of the fastest company growing sector

• Project Manager

  • Feb 2021 - Present

  -PM and Account Manager of SIP/SLP/5G/AiP PM for US A* company and Fabless Qualcomm/Mediatek-Responsible for~$120M USD/year business revenue-Direct and approaching new SLP/Module/SIP/ASIC FCCSP business in Kinsus Xing-Feng factory

• Associate Project Manager

  • Aug 2018 - Feb 2021

  -PM and Account Manager of SIP/SLP/5G/AiP PM for top US smart phone company -Responsible for~$120M USD/year business revenue-Direct and approaching new SLP/Module/SIP/ASIC FCCSP business in Kinsus Xing-Feng factory



Kinsus Interconnect Technology Corp.標識

• Taoyuan

• Sr. Chief FC Project Manager

  • Jul 2017 - Aug 2018

  -Experiences working with top 20 semiconductor companies in US & Europe -Technology roadmap alignment with customers and factory -Direct coordination of ~$140M USD/year FC business -Experiences working with top 20 semiconductor companies in US & Europe -Technology roadmap alignment with customers and factory -Direct coordination of ~$140M USD/year FC business



Kinsus Interconnect Technology Corp.

• Taiwan
• Semiconductor Manufacturing
• 200 - 300 Employee

• Senior Chief Engineer

  • Aug 2016 - Jul 2017

  -Manager for South East Asia Region & FlipChip Product Manger-Supervising Japan Sales Team and new engineering training-Leading automotive qualification in Kinsus China factory-Camera module sensor for high-end smart phone target 180M pcs/year in 2017 2H

• Accociate Manager

  • Feb 2015 - Aug 2016

  -Manager for South East Asia Region team ~$64M USD/year-Automotive customer approaching and HVM $10M USD/year-More than 5 years of substrates technology, process, cost structure, & planning experience

• Senior Sales Engineer

  • Aug 2010 - Aug 2015

  -South East Asia Region Sales for $40M USD/year-Develop with new RF end customer in 2013 and in 2014 contribute 12M USD /year-Develop with top automotive customer for power train related business -Direct coordination with OSAT/IDM/End customers on NPI projects and price negotiation to meet company business plan-Internal substrates design training (Genesis software), technology, substrates design rules, and roadmap presentation skills-Detail cost structure breakdown and value engineering programs on Au reductions Show less

• Sales Engineer

  • May 2008 - Aug 2010

  -Design coordinator for top US Fab-less customer contribute ~$80M USD/year-Wireless AP analysis and internal priority arrangement for major OSATs-Monthly order, forecast, cost, rebate analysis for management directions-Coordination with multiple departments to meet customer’s quality, service, delivery, and engineering expectation to secured proper share.-Customer service on QBR/QTR meetings with internal managements