Henry Ho
Sr. Advanced Packaging Process Engineer at Cepton- Claim this Profile
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English -
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Vietnamese -
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Bio
Credentials
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Level II Auto Ball Bonder - Set up & Advanced maintenance “Iconn Plus and Rapid pro” bonder
Kulicke & SoffaDec, 2019- Nov, 2024 -
Adjuster Training : Datacon 2200 evo Die Bonder
Besi Netherlands B.V.Nov, 2018- Nov, 2024 -
Level I: Automatic Ball Bonder - IConn plus
Kulicke & SoffaJan, 2018- Nov, 2024 -
Vitros Immune Diagnostics System Field Engineer Training Program.
Johnson & JohnsonApr, 2014- Nov, 2024 -
MEDIVATORS Renal System training.
Medivators, a Cantel Medical CompanyJun, 2013- Nov, 2024 -
Application and Service Training for EON100 Biochemistry .
Vital Diagnostics, Inc.Nov, 2012- Nov, 2024 -
BD Bactec 9000 Service Training
BDFeb, 2011- Nov, 2024 -
BD Bactec MGIT 320 Service Training
BDFeb, 2011- Nov, 2024 -
BD phoenix 100 Service Training
BDFeb, 2011- Nov, 2024 -
Cobe Spectra Apheresis System
Terumo BCTApr, 2008- Nov, 2024 -
Trima Automated Blood Collection System
Terumo BCTApr, 2008- Nov, 2024 -
Service Training course for Hematology Analyzers
NIHON KOHDEN EUROPE GmbHJun, 2006- Nov, 2024 -
Technical Service Training for AK 96 Kidney machine
Baxter International Inc.Oct, 2015- Nov, 2024
Experience
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Cepton
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United States
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Motor Vehicle Manufacturing
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1 - 100 Employee
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Sr. Advanced Packaging Process Engineer
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Nov 2022 - Present
•- Lead packaging process development for next-generation optoelectronics modules, including die attachment, wire bonding, encapsulation, and micro-optics integration. - Collaborate with the module design team to ensure processes meet product specifications. - Conduct Root Cause Analysis to troubleshoot and eliminate defects, utilizing Design of Experiments (DOE) for development and sustaining activities. - Coordinate with suppliers and manufacturers to validate and implement the process flow for high-volume production. - Create technical reports and maintain process documentation with SPC. Show less
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AmTECH Microelectronics
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United States
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Appliances, Electrical, and Electronics Manufacturing
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1 - 100 Employee
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Sr. Microelectronics Process Engineer
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Apr 2021 - Nov 2022
- Programmed and operated automation equipment for production and prototyping, such as Datacon die attach (EVO and EVO Plus) and wire bonders (H&K BJ820 and K&S IConn Plus). - Analyzed failures and determined root causes in collaboration with R&D teams and vendors. - Designed tooling, fixtures, and work holders using SolidWorks and Fusion 360 software. - Developed process instructions and related manufacturing documentation. - Responsible for cleanroom equipment troubleshooting and maintenance. Show less
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Promex Industries Inc.
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United States
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Medical Equipment Manufacturing
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1 - 100 Employee
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Process Engineer
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Jan 2018 - Apr 2021
- Programmed and operated die attach and wire bond machines for production and prototype development. - Improved processes for surface mount, wafer thinning, singulation, die attach, wire bonding, and encapsulation. - Conducted Preventive Maintenance (PM) tasks and diagnosed equipment issues. - Collaborated with vendors to troubleshoot and resolve equipment problems. - Utilized SolidWorks for process and tooling design. - Programmed and operated die attach and wire bond machines for production and prototype development. - Improved processes for surface mount, wafer thinning, singulation, die attach, wire bonding, and encapsulation. - Conducted Preventive Maintenance (PM) tasks and diagnosed equipment issues. - Collaborated with vendors to troubleshoot and resolve equipment problems. - Utilized SolidWorks for process and tooling design.
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DunAn Sensing
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United States
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Industrial Machinery Manufacturing
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1 - 100 Employee
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Process Engineer
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Nov 2016 - Dec 2017
- Programmed and set up Datacon die attach machine and wire bond machines (HESSE and K&S IConn Plus). - Performed wire pull, capillary and wire change, and calibration. - Operated various equipment with speed and accuracy. - Collaborated with R&D and production teams. - Conducted crimping, laser marking, epoxy filling, and helium leak testing. - Programmed and set up Datacon die attach machine and wire bond machines (HESSE and K&S IConn Plus). - Performed wire pull, capillary and wire change, and calibration. - Operated various equipment with speed and accuracy. - Collaborated with R&D and production teams. - Conducted crimping, laser marking, epoxy filling, and helium leak testing.
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Eastern Medical Equipment - Thiết bị Y tế Phương Đông
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Vietnam
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Medical Equipment Manufacturing
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1 - 100 Employee
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Field Services Engineer
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Jan 2006 - Sep 2016
- Installed and performed preventive maintenance on medical equipment for various brands. - Troubleshot and fixed equipment issues for customers. - Provided training to customers and colleagues on equipment operation. - Specialized in Hematology machines, Automated Blood Collection Systems, Bacteria Systems, Chemistry Systems, Dialyzer Reprocessing Systems, and Immune Diagnostics Systems. - Installed and performed preventive maintenance on medical equipment for various brands. - Troubleshot and fixed equipment issues for customers. - Provided training to customers and colleagues on equipment operation. - Specialized in Hematology machines, Automated Blood Collection Systems, Bacteria Systems, Chemistry Systems, Dialyzer Reprocessing Systems, and Immune Diagnostics Systems.
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Education
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2001 - 2006
Ho Chi Minh University of Technology
Bachelor of Engineering (B.Eng.), Electrical and Electronics Engineering
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