Experience

H K Wentworth Ltd

• United Kingdom
• Chemical Manufacturing
• 1 - 100 Employee

• Technical Director

  • Nov 2018 - Present

  - participate in formulating company development strategy and annual business plan; - formulate strategic plans for technological development and enhancing the core competitiveness of the company; - organize planning, manpower layout, training communication, system and process construction; - participate in the establishment of R & D related job performance appraisal, cooperate with implementation and continuous improvement; - use and manage related experimental equipment, focus on thermally conductive materials, electrically conductive materials, UV 3 proofings materials, electronic washers, etc. - organize and participate in technical exchange activities with customers, understand the needs of the market and customers, especially the special needs, in order to continuously meet the needs of the market and customers; - fulfill other tasks related to R & D or management assigned by superiors. Show less



Tianhe Group

• China
• Chemical Manufacturing
• 1 - 100 Employee

• Dean of the Institute

  • Jun 2018 - Nov 2018

  In charge of the institute of Tianhe Group focusing on products development and administrative management which covers 4 subsidiaries of Tianhe Group:1. Tianhe Resin Co., Ltd2. Tianhe New Material Co., Ltd3. Daoming Chemical Co., Ltd4. Daoming Adhesive Co., Ltd

• Technical Manager

  • Dec 2017 - May 2018

  Responsible for: 1. Acrylic adhesives; 2. PU adhesives; 3. MS adhesives; 4. Epoxy adhesives; 5. Silicone adhesives; 6. Hotmelt adhesives; 7. Electrically conductive adhesives; 8. Thermally conductive adhesives; 9. Solar silver inks; 10. Potentiometer carbon inks; 11. Flexible antenna silver inks; 12. Metal mesh silver inks; 13. Die attach paste; 14. Encapsulates.



Henkel

• Germany
• Manufacturing
• 700 & Above Employee

• PD Scientist

  • May 2015 - Nov 2017

  Develop low temperature sintering silver inks for HIT solar cells, printed electronic materials for TSP, high performance pastes for Die Attach, ...... Develop low temperature sintering silver inks for HIT solar cells, printed electronic materials for TSP, high performance pastes for Die Attach, ......



Osaka University

• Research
• 700 & Above Employee

• Specially Appointed Researcher

  • Feb 2013 - Mar 2015

  Printed electronic materials, flexible electronic materials, and smart electronic materials (e.g., ultra-fast photonic curing electrically conductive adhesives, high performance printable, stretchable electrical conductors, super flexible, highly conductive electrical compositor, copper-silver based electrically conductive adhesives, and electrically conductive textiles) from vinyl ester resin, polyurethane, polyvinyl alcohol, textiles, silver flakes, copper powders, and silver wires through printing, blending, intense pulsed light, in-situ polymerization, and dipping-drying method. Show less



National Sun Yat-sen University

• Taiwan
• Higher Education
• 400 - 500 Employee

• Postdoctoral Fellow

  • Feb 2012 - Jan 2013

  1) Thermo-sensitive supramolecules from poly(N-isopropyl acrylamide) and adenine-functionalized poly(ethylene oxide) through complementary multiple hydrogen bonds. 2) Exfoliated nanocomposites from organic montmorillonite, polyhedral oligomeric silsesquioxane (POSS), polyvinyl acetate, N-hydroxymethyl acrylamide, and polybenzoxazine through blending, in-situ polymerization, and click chemistry. 1) Thermo-sensitive supramolecules from poly(N-isopropyl acrylamide) and adenine-functionalized poly(ethylene oxide) through complementary multiple hydrogen bonds. 2) Exfoliated nanocomposites from organic montmorillonite, polyhedral oligomeric silsesquioxane (POSS), polyvinyl acetate, N-hydroxymethyl acrylamide, and polybenzoxazine through blending, in-situ polymerization, and click chemistry.



Shanghai University

• Education Administration Programs
• 700 & Above Employee

• Postdoctoral Fellow

  • Jan 2010 - Jan 2012

  Reeearch: Work on the electronic packaging materials, mainly including electrical conductive adhesives, epoxy molding compound, thermal interface material, thermal conductive adhesives, et al.. 1) Use different electrical conductive particles and matrix resin to prepare different modal electrical conductive adhesives. 2) Add some functional agent, or synthesize some new epoxy with special functional groups, to improve the toughness of epoxy molding compound. 3) Mix hotmelt and polyurethane together in solution, and electrospin them to prepare viscous thermal interface material. 4) Use different thermal conductive particles and matrix resin to prepare different modal thermal conductive adhesives. Show less



Shanghai Shang Da Rui Hu Microsystem Integration Technology Co., Ltd.

• R & D Manger

  • Jan 2010 - Jan 2012

  Research: Work on the electronic packaging materials, mainly including electrical conductive adhesives, epoxy molding compound, thermal interface material, thermal conductive adhesives, et al.. 1) Use different electrical conductive particles and matrix resin to prepare different modal electrical conductive adhesives. 2) Add some functional agent, or synthesize some new epoxy with special functional groups, to improve the toughness of epoxy molding compound. 3) Mix hotmelt and polyurethane together in solution, and electrospin them to prepare viscous thermal interface material. 4) Use different thermal conductive particles and matrix resin to prepare different modal thermal conductive adhesives. Show less



Darbond Technology Co., Ltd.

• China
• Industrial Machinery Manufacturing
• 1 - 100 Employee

• R & D Manger

  • Jul 2009 - Dec 2009

  Mainly worked on the UV dam and underfill for IC encapsulation in smart card. 1) Prepared a novel, liquid, trifunctional cycloaliphatic, cationic photo curing epoxy, and its thermal and cationic photo initiator. 2) Studied hotmelt, polyether ammine, electrical conductive adhesive, thermal interface materials and electronic packaging. Mainly worked on the UV dam and underfill for IC encapsulation in smart card. 1) Prepared a novel, liquid, trifunctional cycloaliphatic, cationic photo curing epoxy, and its thermal and cationic photo initiator. 2) Studied hotmelt, polyether ammine, electrical conductive adhesive, thermal interface materials and electronic packaging.