Gun Zhang

Head of project management department / Project Director / PDT at GoerTek
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Contact Information
us****@****om
(386) 825-5501
Location
Qingdao City, Shandong, China, CN
Languages
  • Japanese Full professional proficiency
  • English Professional working proficiency

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Credentials

  • PMP certification
    Project Management Institute
    Jan, 2017
    - Nov, 2024
  • TOEIC 605
    ETS
    Jan, 2009
    - Nov, 2024
  • 日语能力考试 1级
    日本国际交流基金会
    Jan, 2008
    - Nov, 2024
  • CET 4
    国家教育部考试中心
    Jan, 2004
    - Nov, 2024

Experience

  • GoerTek
    • Head of project management department / Project Director / PDT
      • Jul 2011 - Present

      1. 承接事业部项目各项绩效指标，带领团队从技术，制造，供应链等各领域达成；2. 承接和规划事业部/产品线的战略,带领团队打粮食的同时，服务于未来项目获取；3. 负责对项目整体价格，零件价格的审核和对公司经营高层汇报和最终客户解释；4. 协助交付代表组织和协调各种资源，解决项目领域遇到的各种难题，完成交付；5. 动态监控项目盈利能力，不断提出改善目标，带领团队完成改善课题；1. Undertake KPI of BU, lead the team to achieve from technology, manufacturing, supply chain and other fields.2. Undertake and plan the strategy of the business division / product line, lead the team to make profits, meanwhile to acquire future projects.3. Be responsible for… 1. 承接事业部项目各项绩效指标，带领团队从技术，制造，供应链等各领域达成；2. 承接和规划事业部/产品线的战略,带领团队打粮食的同时，服务于未来项目获取；3. 负责对项目整体价格，零件价格的审核和对公司经营高层汇报和最终客户解释；4. 协助交付代表组织和协调各种资源，解决项目领域遇到的各种难题，完成交付；5. 动态监控项目盈利能力，不断提出改善目标，带领团队完成改善课题；1. Undertake KPI of BU, lead the team to achieve from technology, manufacturing, supply chain and other fields.2. Undertake and plan the strategy of the business division / product line, lead the team to make profits, meanwhile to acquire future projects.3. Be responsible for reviewing the overall price of the project and the price of parts, achieve a win-win price for the company and customers.4. Assist the delivery representative to organize and coordinate various resources, solve problems encountered in the project area and complete the delivery.5. Dynamically monitor the profitability of the project, constantly propose improvement objectives, and lead the team to complete the improvement tasks. Show more Show less

  • Japan Fit / Shinkawa Co., Ltd
    • Engineer and Manager
      • Jul 2006 - May 2011

      1. 采用Verilog语言对半导体制造设备Die Bonder的回路部分进行规划和设计；2. 负责设计方案的试验搭建和完成实验数据采集；3. 负责协同美国芯片方，中国生产方，日本设计方沟通，完成项目课题；1. Using Verilog language to design FPGA circuit of Die bonder and Wire Bonder.2. Be responsible for the experimental construction of the design proposal and experiment data collection and analyzing.3. Coordinate with us chip company, Chinese manufacturer and Japanese designer to complete the project.

Education

  • Ocean University of China
    -
  • Hubei University of Automobile Technology
    -

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