Experience

Micropac Industries Inc

• United States
• Semiconductor Manufacturing
• 1 - 100 Employee

• Customer Response Manager

  • Feb 2018 - Present



ENTOUCH

• United States
• IT Services and IT Consulting
• 1 - 100 Employee

• Production Operator

  • Jun 2016 - Dec 2017

  • Eager to Accept New Challenges and Initiatives – Assumed Production Management activities during the transition of the Operations Manager.• Programmed and tested sub-assemblies that resulted in high quality products being shipped to customers.• Created spreadsheets and templates for reporting finished goods and production through-put to management. • Performed the role as Purchasing Agent so that production and prototype materials were readily available.• Coordinated assembly builds at subcontractors that resulted in the on-time deliveries to customers.• Supported the shipment of materials to field service department so that materials where available for installation on each site.• Monitored Build of Materials and Engineering Change Management for each product using Areana Software Tool.



Innovative-IDM

• United States
• Automation Machinery Manufacturing
• 1 - 100 Employee

• Production Control

  • Dec 2014 - Mar 2016

  • Initiative and Influence Management – Instrumental in creating a production schedule matrix to ensure on on-time deliveries of customer orders. The matrix was well received and approved by management.• Implemented a new production schedule management process that improved on-time delivery of customer orders. • Maintained materials and supplies for the production floor.• Served as purchasing agent to mitigate part shortages for customer orders.• Assisted in Project Management duties.



Trilogy Circuits

• Project Coordinator

  • May 2011 - Nov 2013

  • CM Liaison - Lead Customer point of contact for Design for Manufacturability. Experienced in Aerospace ISO9001:2008, AS9100C & ITAR Certified NPI Industry with RFQ, Quote, PO, Scheduling, Planning and RMA transactions.• Implementing Business Controls-Managed reviews of printed circuit board fabrications that resulted in the release of high-quality assemblies-minimizing and in many case totally eliminating rework.• Created a centralized database to ensure the adherence of customer quality codes.• Managed the assembly documentation and special instructions to initiate the start of each assembly build.• Coordinated Request for Quote requirements to ensure competitive pricing for customers.



Hewlett Packard Enterprise

• United States
• IT Services and IT Consulting
• 700 & Above Employee

• PCA Manufacturing Engineer

  • 1995 - 2009

  • Negotiation and Change Agent – Developed, drove and implemented a Design for Reliability process flow for new technology qualifications.• Investigated and identified various component solder joint level failure modes that emerge in printed circuit assembly designs.• Analyzed failure modes to determine root cause and made proposals to design them out.• Led the Chip Scale Package and Fine Pitch Ball Grid Array component implementation project for High End, Mid-Range, and Low-End servers. • Coordinated component solder joint reliability qualification projects.• Identified potential issues then defined contingency plans for new component technologies early in the design phase to ensure high reliability.



Convex Computer Corporation

• United States
• Computer Hardware Manufacturing

• Assembly Process Technician

  • 1988 - 1995

  • Stakeholder Management – Fostered close relationships with assembly sites by successfully performing qualifications for complex interconnects at HP internal sites and various Contract Manufacturers.• Developed processes for surface mount assemblies which included stencil print, pick-n-place, reflow and wave soldering. Also, experienced in programming pick-n-place equipment and Automated Optimal Inspection (AOI) equipment.• Led a team that established and implemented the procedures for synchronizing printed circuit assemblies. Transitioned the assembly builds from start to functional prototypes while ensuring the required build quantities were met.• Managed outsource activities that transitioned printed circuit assembly builds to internal HP Manufacturing Sites and external Contract Manufactures (CMs).