Experience

Buckley Systems Ltd

• New Zealand
• Industrial Machinery Manufacturing
• 100 - 200 Employee

• Mechanical Design Engineer

  • May 2023 - Present



Motovated - Engineering Your Vision

• New Zealand
• Industrial Machinery Manufacturing
• 1 - 100 Employee

• Mechanical consulting engineer

  • Jun 2022 - Feb 2023



Freelancer

• Korea

• Mechanical Design Engineer

  • Sep 2017 - Feb 2019

  • Mechanical Design: BLDC MOTOR, Parking Control System, Traffic Enforcement Camera • Design with Pro/E(Creo) and Solid Works • Worked and followed up all process with responsibility; From design conception mechanical design, manufacturer, schedule, documents, and so on. • Mechanical Design: BLDC MOTOR, Parking Control System, Traffic Enforcement Camera • Design with Pro/E(Creo) and Solid Works • Worked and followed up all process with responsibility; From design conception mechanical design, manufacturer, schedule, documents, and so on.



SNTech Inc.

• Appliances, Electrical, and Electronics Manufacturing
• 1 - 100 Employee

• Mechanical Design Engineer

  • Sep 2012 - Apr 2015

  • HVAC Motor project • Mechanical design using Pro/E, with additional consideration to mechanical functions, electronic parts, mechanical issues in the development process. • Constantly communicated and worked with a Sales team of Head office of USA (Market: USA, Head Office: USA) • HVAC Motor project • Mechanical design using Pro/E, with additional consideration to mechanical functions, electronic parts, mechanical issues in the development process. • Constantly communicated and worked with a Sales team of Head office of USA (Market: USA, Head Office: USA)



Foxconn

• Appliances, Electrical, and Electronics Manufacturing
• 700 & Above Employee

• Mechanical Design Engineer

  • Jun 2008 - Jun 2011

  Cellular Phone Mechanical Engineer, FIH (Foxconn), Seoul, South Korea June 2008 to June 2011 • Phone design: Side slide1 model (NOKIA/Market: USA), Mono block 1 model (SKT/Market: KOREA) • Mechanical design using Pro/E, with additional consideration to mechanical functions and electronic parts in the development process. • Coordinated work with many cross-functional teams, including Industrial Design, Packaging, Designers, Hardware engineering, and Marketing for the project. • Communicated via conference with many foreign companies in English, Korean and Chinese. • Maintained track production through every building stage (including mass production) on business trips to China, and continually reviewed the field return defects analyses. Design o Injection moulding, Press, Double shot injection moulding, Insert moulding, plastic (PC, PC+G/F), metal (SUS), TSP (Capacitive type, resistive type), etching, Tolerance Analyses(TA), EM stacking (for EM parts), inlet (for logo), die-cutting parts, torsion spring, EMI gasket, shield can (can type, clip type), and assembly. Finish o VM, NCVM, UV coating, Silk print, and half mirror print. Process o Field return analyses, Package, Mock up for DP,SAP, PDM, BOM, MAR, CPK, FEA, ISO 9001. Main issues solved during the development o Minimized a big gap between the covers, adjusted the key size to improve functionality and eliminate clicking, corrected a flaw in the proximity sensor, modified the adhesive to prevent touch screen from floating, corrected the unmatched NCVM/VM/Paint colour, improved the feel of key tactility, and improved the phone’s slide function. Show less