Feynman Yen
封裝特性分析工程師（package thermal & stress, moldflow simulation） at SPIL- Claim this Profile
Contact Information
us****@****om
(386) 825-5501
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Location
Taichung City, Taichung City, Taiwan, TW
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Experience
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SPIL 矽品
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Taiwan
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Semiconductor Manufacturing
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200 - 300 Employee
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封裝特性分析工程師（package thermal & stress, moldflow simulation）
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Jan 2006 - Present
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Education
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NCTU
Master's degree, 機械工程學系
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