Feng Kan

Head of Platform Software at EdgeQ Inc.
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Contact Information
us****@****om
(386) 825-5501
Location
US

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Bio

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Experience

  • EdgeQ Inc.
    • United States
    • IT Services and IT Consulting
    • 100 - 200 Employee
    • Head of Platform Software
      • Oct 2019 - Present

  • Ampere
    • United States
    • Semiconductor Manufacturing
    • 700 & Above Employee
    • Senior Principal Engineer
      • Jan 2018 - Sep 2019

  • AppliedMicro
    • United States
    • Semiconductor Manufacturing
    • 100 - 200 Employee
    • Principal Software Engineer
      • Jun 2006 - Feb 2018

      SOC BSP. Board bring up, PCIE, USB, I2C, SATA, NOR/NAND, DDR, Linux Kernel (SMP/AMP). ARM64, PPC, Virtualization. SOC BSP. Board bring up, PCIE, USB, I2C, SATA, NOR/NAND, DDR, Linux Kernel (SMP/AMP). ARM64, PPC, Virtualization.

  • Symmetricom is now Microsemi
    • Semiconductor Manufacturing
    • 100 - 200 Employee
    • Software Engineer
      • Jan 2000 - Jun 2006

Education

  • University of Alberta
    Bachelor of Engineering - BE, Computer Engineering

Community

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