Experience

Beijing University of Technology

• China
• Higher Education
• 400 - 500 Employee

• Professor

  • Jan 2001 - Present

  Director, Institute of Electronic Packaging Technology & Reliability College of Mechanical Engineering and Applied Electronics Technology Beijing University of Technology Beijing 100124, China Research fields: (1) Simulations and characterization of the mechanical behavior of the materials, structures and manufacturing processes in electronic packages. (2) Computer methods in materials science and engineering. (3) Design for reliability of electronic packaging. Director, Institute of Electronic Packaging Technology & Reliability College of Mechanical Engineering and Applied Electronics Technology Beijing University of Technology Beijing 100124, China Research fields: (1) Simulations and characterization of the mechanical behavior of the materials, structures and manufacturing processes in electronic packages. (2) Computer methods in materials science and engineering. (3) Design for reliability of electronic packaging.



Nanyang Technological University Singapore

• Singapore
• Higher Education
• 700 & Above Employee

• PDF,RF

  • Aug 1997 - Dec 2000

  Post Doctorial Fellow and Research Fellow at School of Civil and Structures Post Doctorial Fellow and Research Fellow at School of Civil and Structures