Experience

ASE Group Global

• Taiwan
• Semiconductor Manufacturing
• 100 - 200 Employee

• Department Manager

  • Sep 2018 - Present

• Deputy Department Manager

  • Jul 2013 - Present

  1. PM of NPI execution2. Business/Technology promotion3. Technical supports of package/assembly process4. MEMS / Optical sensor package5. Automotive device package/assembly6. Trouble shooting and problem solving7. Team build-up8. Cross-department coordination for project management to meet project schedule, quality and customer satisfaction.Major achievement : 1. NPI to MP for healthy monitor sensor (1st optical sensor to MP, for Tier 1 customer)2. NPI to MP for MEMS motion sensors (for Tier 1 MEMS fabless customer) 3. Lead a team to successfully bring up an IDM customer to transfer MP products to ASECL (for Top 5 analog semiconductor company)4. As an account PM, drive the revenue with 4 times growth from 2016 to 2018. 5. Win customer's award as 2018 Best Supplier Show less



Liteon Semiconductor Corp.

• Semiconductor Manufacturing
• 1 - 100 Employee

• Product Manager

  • Jul 2010 - Jul 2013

  1. PM of Light sensor products (ALS/PXY/Color sensor/) 2. Light sensor product roadmap 3. Product strategy including development, manufacture, business. 4. Project management about scope, schedule, cost, quality and risk. 5. Cross-department coordination to meet project schedule, quality and customer satisfaction. 6. Technical support and review including design, testing, assembly and application Major achievement 1. ALS NPI to MP for Tablet (for Tier 1 Korean customer) 2. ALS/PXY 2-in-1 NPI to MP for smart phone (for China customers) 3. ALS/PXY/IRLED 3-in-1 module NPI to MP for smart phone (for China customers) Show less



Touch Micro-System Technology Corp.

• Taiwan
• Semiconductors
• 1 - 100 Employee

• Section Leader

  • Oct 2002 - Jun 2010

  1. Modeling and Simulation of MEMS device (Stress/Thermal/Electrical) 2. Photo-lithography process development for MEMS 3. MEMS wafer process integration and development 4. Trouble shooting and problem solving 1. Modeling and Simulation of MEMS device (Stress/Thermal/Electrical) 2. Photo-lithography process development for MEMS 3. MEMS wafer process integration and development 4. Trouble shooting and problem solving