Experience

Kokusai Semiconductor Equipment Corporation

• United States
• Semiconductor Manufacturing
• 1 - 100 Employee

• Field Services Engineer

  • Mar 2022 - Present



NXP Semiconductors

• Netherlands
• Semiconductor Manufacturing
• 700 & Above Employee

• Engineering Technician

  • Nov 2019 - Mar 2022



Randstad Engineering US

• United States
• Staffing and Recruiting
• 200 - 300 Employee

• Manufacturing Technician

  • Feb 2019 - Nov 2019

  working in the Echo fab where I have been trained in Back-side metals where I load lots onto tools that will deposit gold or silver onto the back of the wafer. I am also responsible for troubleshooting tools to keep production moving throughout the fab. As well as conducting regular PMs and daily QUALS. working in the Echo fab where I have been trained in Back-side metals where I load lots onto tools that will deposit gold or silver onto the back of the wafer. I am also responsible for troubleshooting tools to keep production moving throughout the fab. As well as conducting regular PMs and daily QUALS.



MSR-FSR, LLC

• United States
• Semiconductors
• 100 - 200 Employee

• Equipment Technician (L2)

  • May 2018 - Jan 2019

  In this position I was a L2 equipment technician. I was responsible for Qualifying and refurbishing ASM and Hitachi modules for semiconductor equipment for Intel. In this role I use power tools, DVMs, micrometers, CMM gauges and proper PPE as required. In this position I was a L2 equipment technician. I was responsible for Qualifying and refurbishing ASM and Hitachi modules for semiconductor equipment for Intel. In this role I use power tools, DVMs, micrometers, CMM gauges and proper PPE as required.