Experience

COFAN USA
• United States
• Appliances, Electrical, and Electronics Manufacturing
• 1 - 100 Employee
• Mechanical Engineer

  • Apr 2019 - Present


AMD

• France
• Architecture and Planning
• 1 - 100 Employee

• Member Technical Staff - Thermal and Mechanical Engineering

  • Aug 2011 - Jun 2015

  - Consulted OEM/ODM customers to design thermal solution with AMD products. - Performed on-site engineering support with local engineer team of customers, suppliers and partners in thermal and mechanical field. - Guided customers to optimize the system performance, thermal and power via AMD thermal and power management. - Entailed experimental thermal and mechanical work directed at development of thermal solutions, mechanical design of components and systems, and thermal simulation… Show more - Consulted OEM/ODM customers to design thermal solution with AMD products. - Performed on-site engineering support with local engineer team of customers, suppliers and partners in thermal and mechanical field. - Guided customers to optimize the system performance, thermal and power via AMD thermal and power management. - Entailed experimental thermal and mechanical work directed at development of thermal solutions, mechanical design of components and systems, and thermal simulation analysis. Show less - Consulted OEM/ODM customers to design thermal solution with AMD products. - Performed on-site engineering support with local engineer team of customers, suppliers and partners in thermal and mechanical field. - Guided customers to optimize the system performance, thermal and power via AMD thermal and power management. - Entailed experimental thermal and mechanical work directed at development of thermal solutions, mechanical design of components and systems, and thermal simulation… Show more - Consulted OEM/ODM customers to design thermal solution with AMD products. - Performed on-site engineering support with local engineer team of customers, suppliers and partners in thermal and mechanical field. - Guided customers to optimize the system performance, thermal and power via AMD thermal and power management. - Entailed experimental thermal and mechanical work directed at development of thermal solutions, mechanical design of components and systems, and thermal simulation analysis. Show less



Hewlett-Packard

• United States
• Information Technology & Services
• 300 - 400 Employee

• Thermal Engineer - DTO R&D, PSG, Enterprise Product

  • Apr 2011 - Aug 2011

  - Designed thermal module of commercial Desktop PC, Thin-Client and POS system to meet HP's thermal and acoustic criteria. - Prepared 2D/3D drawing and performed FEA simulation to confirm design concept. - Verified tooling sample, built BOM table, defined validation plan and reliability test criteria to suppliers. - Communicated with cross functional development teams on thermal features, requirements, cost, and schedules - Designed thermal module of commercial Desktop PC, Thin-Client and POS system to meet HP's thermal and acoustic criteria. - Prepared 2D/3D drawing and performed FEA simulation to confirm design concept. - Verified tooling sample, built BOM table, defined validation plan and reliability test criteria to suppliers. - Communicated with cross functional development teams on thermal features, requirements, cost, and schedules

• Senior Thermal and Mechanical Engineer

  • Nov 2005 - May 2010

  - Defined, guided and completed statistical data reduction of thermal lab experiments to characterize thermal materials, cooling components and cooling system. - Reviewed customer’s thermal design, thermal and power management by thermal simulation and validation result. - Debugged and provided the countermeasures of thermal and mechanical issues to customers - Defined, guided and completed statistical data reduction of thermal lab experiments to characterize thermal materials, cooling components and cooling system. - Reviewed customer’s thermal design, thermal and power management by thermal simulation and validation result. - Debugged and provided the countermeasures of thermal and mechanical issues to customers



MiTAC Inc.

• Taiwan
• Software Development
• 200 - 300 Employee

• Manager of Thermal and Acoustic Developement Department

  • Jul 2002 - Nov 2005

  - Administered thermal team included Taiwan and Shanghai site. - Supervised thermal engineers in all aspects of concept development, analysis, design and specification. - Led thermal team to research advanced technologies in thermal management field included new thermal material, new type centrifugal fan and thermal application.

• Thermal Engineer

  • Apr 1999 - Jul 2002

  - Designed thermal module for Laptop system included 2D/3D drawing, thermal simulation, BOM table, tooling verification and performance validation.