Eno Lin

Package Material Sr. Engineer at 日月光集團
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Contact Information
us****@****om
(386) 825-5501
Location
Taoyuan City, Taoyuan City, Taiwan, TW

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Experience

    • Taiwan
    • Semiconductor Manufacturing
    • 100 - 200 Employee
    • Package Material Sr. Engineer
      • Aug 2017 - Present

    • SQE Sr. Engineer
      • Dec 2016 - Aug 2017

      • Co-work with R&D for new material and supplier survey• Incoming quality control plan• Abnormal material analysis and investigation• Supplier management• Customer audit assistance

    • Taiwan
    • Semiconductor Manufacturing
    • 200 - 300 Employee
    • R&D Chief Engineer
      • Nov 2015 - Dec 2016

      • Cavity substrate and relative patent development• Microelectromechanical coil with substrate technology and relative patent development• New process, material, tooling and machine survey for advance technology

    • R&D Sr. Engineer
      • Sep 2013 - Oct 2015

      • Ultra thin substrate and process development• Multi-layer embedded substrate and process development

    • R&D Engineer
      • Aug 2011 - Aug 2013

      • Fine pitch AOI & AVI machine evaluation and import to mass production• Substrate defect mapping automation system establishment

Education

  • National Taipei University of Technology
    Master, Chemical Engeering
    -

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