Experience

Synergie CAD SEMICONDUCTORS (PSC)

• France
• Semiconductors
• 1 - 100 Employee

• Microelectronic Packaging Engineer

  • Nov 2022 - Present

  Manage packaging projects, from NPI to large scale production through our Top3 OSAT partnership. Working on a large portfolio of packages : (FC)BGA/LGA/CSP, WLCSP (Fan In), advanced packaging technologies Manage packaging projects, from NPI to large scale production through our Top3 OSAT partnership. Working on a large portfolio of packages : (FC)BGA/LGA/CSP, WLCSP (Fan In), advanced packaging technologies



Innoptics

• France
• Semiconductors
• 1 - 100 Employee

• Optoelectronic Packaging Engineer

  • Jul 2017 - Sep 2022

  Expertise in optical package design and assembly process of various laser diode technologies : - Select/Design package&materials for mechanical, electrical and thermal management of semiconductor lasers (VCSEL, QCL, photodiode...) - Optimize process for assembly and connection (soldering, gluing, flip chip bonding, thermocompression, wire bonding) - Control and qualification of new process or new materials in collaboration with vendors - Manage small to medium production lots Expertise in optical package design and assembly process of various laser diode technologies : - Select/Design package&materials for mechanical, electrical and thermal management of semiconductor lasers (VCSEL, QCL, photodiode...) - Optimize process for assembly and connection (soldering, gluing, flip chip bonding, thermocompression, wire bonding) - Control and qualification of new process or new materials in collaboration with vendors - Manage small to medium production lots



Société des Céramiques Techniques (SCT)

• Bazet

• Process Development Engineer

  • Nov 2016 - Jul 2017

  Expertise in ceramic-to-metal bonding process for medical packages : - Develope next generation of products (from prototype to qualification lots) : gold brazing zirconia package (for cochlear implant), filtrated feedthrough (for pacemaker) - Manage qualification of bonding process & new equipment prior industrialization (ex.: automatic dispensing machine) - Set up quality indicators and define action plans (mechanical redesign, DoE, audit) to improve process control - Multi-projects management / Production team management / Solve production technical issues Show less



NovaPack SAS

• Région de Bordeaux , France (ICMCB)

• Microelectronic Process Engineer

  • Jan 2013 - Oct 2016

  Responsible for the development of innovative packaging technologies for power applications : HHL/butterfly or on-demand packages with new high temperature interconnects & heat dissipative carbon/metal base plate. - Developed bonding techniques : Diffusion soldering; Silver sintering; Brazing (SnAgCu, AuSn) - Assessed reliability and performance of assemblies through microstructural, chemical and mechanical analysis - Evaluated the feasibility of packaging concepts through Finite Element Modelisation (Comsol) - Managed R&D projects: active involvement in SatPack, NanoHiTEC and WPack European project Show less



École Nationale Supérieure de Chimie et Physique de Bordeaux (ENSCPB)

• Teaching Assistant

  • Sep 2014 - Sep 2015

  - Delivered courses in Mechanic and Thermodynamic to Master's students - Managed a 50 students class - Delivered courses in Mechanic and Thermodynamic to Master's students - Managed a 50 students class



ASML

• Netherlands
• Semiconductor Manufacturing
• 700 & Above Employee

• R&D Materials Engineer (intern)

  • Jul 2010 - Nov 2010

  Developed and characterized nanostructured superhydrophobic coatings for lithography scanners application - Work done in cleanroom environment. Main achievements: - Determined the lifetime expectancy of the coatings. - Wrote a detailed technical report and a publication (see publications section). Associated technical skills: Semiconductor production process (Front-end) ; PVD techniques ; Microstructural characterization (SEM) ; Contact angle measurements. Developed and characterized nanostructured superhydrophobic coatings for lithography scanners application - Work done in cleanroom environment. Main achievements: - Determined the lifetime expectancy of the coatings. - Wrote a detailed technical report and a publication (see publications section). Associated technical skills: Semiconductor production process (Front-end) ; PVD techniques ; Microstructural characterization (SEM) ; Contact angle measurements.