Edward Ko
Senior Manager at Kinsus Interconnect Technology Corp.- Claim this Profile
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Bio
Experience
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Kinsus Interconnect Technology Corp.
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Taiwan
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Semiconductor Manufacturing
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200 - 300 Employee
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Senior Manager
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Apr 2017 - Present
Product: (MSAP) modified-semi-additive process Department :Manufacturing engineering In charge for Yield improvement , Quality Task force. Product: (MSAP) modified-semi-additive process Department :Manufacturing engineering In charge for Yield improvement , Quality Task force.
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Zhen Ding Technology Holding Limited
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Qinhuangdao, Hebei, China
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QA Manager
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Dec 2015 - Apr 2017
Product: IC substrate: FPS,MMC,CSP In charge for QA department. handling VQA,CQA,PQA,OQC,Lab. Product: IC substrate: FPS,MMC,CSP In charge for QA department. handling VQA,CQA,PQA,OQC,Lab.
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Unimicron
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Taiwan
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Appliances, Electrical, and Electronics Manufacturing
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500 - 600 Employee
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Senior Integrate Manager
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May 2013 - Dec 2015
Product: Flat Chip: FCBGA; Application: PC & Mobile & Sever IC substrate Period:2013~2015 1. In charge for IC substrate FCBGA product Tech. certification on yield improvement target. 2. In charge for Task force team. 3. In charge for Material working group development. Period:2015~ 1. In charge for Sever IC substrate on 20nm device tech. certification on yield improvement target. 2. Integrator between consultant and engineering team for technology solution. Product: Flat Chip: FCBGA; Application: PC & Mobile & Sever IC substrate Period:2013~2015 1. In charge for IC substrate FCBGA product Tech. certification on yield improvement target. 2. In charge for Task force team. 3. In charge for Material working group development. Period:2015~ 1. In charge for Sever IC substrate on 20nm device tech. certification on yield improvement target. 2. Integrator between consultant and engineering team for technology solution.
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Nippon precision technology sdn. bhd.
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Pahang, Malaysia
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Senior QA Manager
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Apr 2011 - Apr 2013
Product:1.CRT: Electron gun parts-metal stamping part & ceramic sintering 2.(Passive component)Crystal oscillation-metal stamping part 1. R&R: Solution for client claim and be integrator between customer and factory manufacturing. 2. (NPI)New product device and new customer tech. cer. readiness 3. Out-sourcing plating survey and regularly audit quality. 4. Lab. analysis in-house facility and SOP instruction readiness. Product:1.CRT: Electron gun parts-metal stamping part & ceramic sintering 2.(Passive component)Crystal oscillation-metal stamping part 1. R&R: Solution for client claim and be integrator between customer and factory manufacturing. 2. (NPI)New product device and new customer tech. cer. readiness 3. Out-sourcing plating survey and regularly audit quality. 4. Lab. analysis in-house facility and SOP instruction readiness.
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Nan Ya PCB Corporation
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Taoyuan City
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Flip Chip Manufacturing CIP Manager
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Oct 1997 - Apr 2011
Product: FCBGA /PBGA /PCB 1.CIP team: 2010~2011 1.1 Enhancing internal efficiency and improving production capacity. 1.2 Targeting customer complaints by setting up improvement groups for serious abnormality and handling cross-departmental coordination and communication. 2.Manufacturing team:2003~2010 2.1 For Technology: 2.1.1 Expanding production capability. 2.1.2 Implement new chemical/material for technology improvement. 2.1.3 De-bottom neck on insufficient facility. 2.2 For Quality: 2.2.1 Control in coming material / operation receipt optimization/ product success criteria 2.2.2 Reviewing and control ISO ,FMEA operating / Organizing staff TPM activity 2.2.3 Enhancing production efficiency, and reliability control 2.2.4 Error proof prevention (anti-mixing) activities for production. 2.3 For Cost: 2.3.1 Searching local supply(or enlarge shift life) for reducing manufacturing costs. 2.3.2 Increasing machine utilization ratio. 2.3.3 Reducing manpower by simplifying procedure. 3.Process Engineer team: 1997~2003 3.1 Prepare process layout for expansion. 3.2 Review and design jig tooling for production match ability. 3.3 Managing production operators 3.4 Simplifying machinery maintenance methods. Show less
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Education
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University College Sedaya International Malaysia
Master of Engineering, Mechanical Engineering -
National Taiwan University of Science and Technology
Bachelor's degree, Science Engineering -
National Kaohsiung University of Applied Sciences
Associate Degree, Mechanical Engineering