Dylan Connelly
Mechanical Engineer at REELEX Packaging Solutions- Claim this Profile
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English Native or bilingual proficiency
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Spanish Limited working proficiency
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Bio
Experience
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REELEX Packaging Solutions
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United States
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Industrial Machinery Manufacturing
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1 - 100 Employee
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Mechanical Engineer
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Jun 2018 - Present
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TELEDYNE MONITOR LABS
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United States
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1 - 100 Employee
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Mechanical Engineer
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Oct 2016 - Feb 2018
• One of two designers and drafters for extractive probes, flow and opacity monitors as well as CEMS systems • 2D & 3D modeling, assembly drawings, detailed drawings, machine drawings and testing • Aided in document control with database management in AX & Access preceding implementation of ECOs • Designed and performed thermal validation tests • Generated test requirements based on system environment, acquired data and presented results • Self-studying for ASME Y14.5 Geometric Dimensioning and Tolerancing Certification, Technologist Level – Looking to take Technologist Level test Show less
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Teledyne LeCroy
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United States
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Appliances, Electrical, and Electronics Manufacturing
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300 - 400 Employee
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Mechanical Engineer
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Jun 2015 - Sep 2016
• Aided in designing, documenting and implementing new oscilloscopes into production • Designed and 3D modeled sheet metal parts and machined parts • Modeled PCBs in conjunction with layout designs for mechanical fit of critical components • Prototyped and tested thermal solutions using fans, ducting and thermal interface materials for low to high bandwidth oscilloscopes • Worked directly with production leads and technicians to assimilate new designs, and gain input for more efficient assembly of new products • Provided engineering support to sustain current oscilloscope models on the market using LeCroy’s PLM system • Managed inventory to eliminate the usage of hazardous substances in production for RoHS certification • Developed designs of injection molded plastics for probe housings • Consisting of preliminary sketches, 3D models, in house 3D printing and prototype testing • Shock, vibration and drop testing of LeCroy oscilloscopes for component and packaging validation – ranging from lowest to highest bandwidth models as well as pre-released designs • Tested probe leads to UL standards in house • Evaluated thermal interface materials for high performance ADCs • Gathered data on the highest performance gels, greases and pads available • Created test setups to evaluate the performance of said materials for use in high bandwidth oscilloscopes Show less
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Teledyne LeCroy
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United States
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Appliances, Electrical, and Electronics Manufacturing
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300 - 400 Employee
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Mechanical Engineering Intern
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Dec 2011 - Jan 2015
• Aided in CAD design for cooling solutions in high end oscilloscopes • Prototyped fan & ducting systems to test and validate cooling solutions • Utilized 3D printing in conjunction with CAD to design and fabricate jigs and fixtures • Assisted in thermal testing of high bandwidth oscilloscopes • Aided in CAD design for cooling solutions in high end oscilloscopes • Prototyped fan & ducting systems to test and validate cooling solutions • Utilized 3D printing in conjunction with CAD to design and fabricate jigs and fixtures • Assisted in thermal testing of high bandwidth oscilloscopes
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Education
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University at Buffalo
Bachelor of Science (BS), Mechanical Engineering -
Temple University
Mechanical Engineering