Douglas Murphy

Real Estate Sales Associate at Prudential Arizona Properties
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Contact Information
us****@****om
(386) 825-5501
Location
Peoria, Arizona, United States, US

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Experience

    • Real Estate
    • 100 - 200 Employee
    • Real Estate Sales Associate
      • May 2013 - Present

      Selling residential real estate. Selling residential real estate.

    • Product Engineering/Quality Engineering
      • Feb 2010 - Apr 2011

      Perform product engineering support for Medical Products. Manage quality improvement team for a key customer Quality improvement issue. Interfaced directly with customer and improved defect rate significantly at St Jude Medical for one of the medical products. Improved reliability testing performance on this same product as well. Took the initiative to set up and lead the Quality improvement team for St Jude defect reduction within 1 month of starting to work for Microsemi. This… Show more Perform product engineering support for Medical Products. Manage quality improvement team for a key customer Quality improvement issue. Interfaced directly with customer and improved defect rate significantly at St Jude Medical for one of the medical products. Improved reliability testing performance on this same product as well. Took the initiative to set up and lead the Quality improvement team for St Jude defect reduction within 1 month of starting to work for Microsemi. This assignment ended coincident with the Microsemi Scottsdale plant closure. Show less Perform product engineering support for Medical Products. Manage quality improvement team for a key customer Quality improvement issue. Interfaced directly with customer and improved defect rate significantly at St Jude Medical for one of the medical products. Improved reliability testing performance on this same product as well. Took the initiative to set up and lead the Quality improvement team for St Jude defect reduction within 1 month of starting to work for Microsemi. This… Show more Perform product engineering support for Medical Products. Manage quality improvement team for a key customer Quality improvement issue. Interfaced directly with customer and improved defect rate significantly at St Jude Medical for one of the medical products. Improved reliability testing performance on this same product as well. Took the initiative to set up and lead the Quality improvement team for St Jude defect reduction within 1 month of starting to work for Microsemi. This assignment ended coincident with the Microsemi Scottsdale plant closure. Show less

    • Semiconductor Manufacturing
    • 700 & Above Employee
    • Individual Contributor
      • 2010 - 2011

    • Program Manager, Device Engineering Manager
      • 2002 - 2007

      9/1/2005 to 8/23/2007 – ON Semi Program Manager for Mfg Technology Deployment Group 10/1/2004 to 9/1/2005 – ON Semi Manufacturing Liaison to Business Unit Interface between BU and Manufacturing to introduce new platforms. Resolve issues between BU and Front-end and Back-end Manufacturing. Manage projects to resolve these issues. 10/1/2004 to 9/1/2005 – ON Semi Manufacturing Liaison to Business Unit Interface between BU and Manufacturing to introduce new platforms.… Show more 9/1/2005 to 8/23/2007 – ON Semi Program Manager for Mfg Technology Deployment Group 10/1/2004 to 9/1/2005 – ON Semi Manufacturing Liaison to Business Unit Interface between BU and Manufacturing to introduce new platforms. Resolve issues between BU and Front-end and Back-end Manufacturing. Manage projects to resolve these issues. 10/1/2004 to 9/1/2005 – ON Semi Manufacturing Liaison to Business Unit Interface between BU and Manufacturing to introduce new platforms. Resolve issues between BU and Front-end and Back-end Manufacturing. Manage projects to resolve these issues. 11/1/2002 to 10/1/2004 – ON Semiconductor Corporate Technology Platform Manager On team to develop technology platform development process and platform manager for several technologies. Broad responsibility for platform qualification crossing many job functions. Assisting in rollout of new Technology Development and Acquisition process (enhancement of technology platform process). Responsible for initiating/coordinating pilot programs. Managed fab transfer projects in addition two of which were the transfer of Mosaic3 and Mosaic5. 11/15/2001 to 11/1/2002 – ON Semiconductor East Greenwich Fab - Program Manager EG Staff Program Manager for Bipolar Analog transfer program to offshore fab in Czech Republic. Also supported Powersense projects in EG fab. Developed strawman strategy proposal for transfer of entire portfolio of products. Drove implementation of Program Management methodology for new technology program as well as fab transfer. 4/1/2001 TO 11/1/2001 – ON Semiconductor Thyristor/Rectifier Device Engineering Manager Class Probe and Process yields improved significantly (from 77% to 91%) in a relatively short time. Managed 8 Device engineers through merger of 2 fabs and a difficult transition since they had to deal with announcement of impending fab closure. Show less 9/1/2005 to 8/23/2007 – ON Semi Program Manager for Mfg Technology Deployment Group 10/1/2004 to 9/1/2005 – ON Semi Manufacturing Liaison to Business Unit Interface between BU and Manufacturing to introduce new platforms. Resolve issues between BU and Front-end and Back-end Manufacturing. Manage projects to resolve these issues. 10/1/2004 to 9/1/2005 – ON Semi Manufacturing Liaison to Business Unit Interface between BU and Manufacturing to introduce new platforms.… Show more 9/1/2005 to 8/23/2007 – ON Semi Program Manager for Mfg Technology Deployment Group 10/1/2004 to 9/1/2005 – ON Semi Manufacturing Liaison to Business Unit Interface between BU and Manufacturing to introduce new platforms. Resolve issues between BU and Front-end and Back-end Manufacturing. Manage projects to resolve these issues. 10/1/2004 to 9/1/2005 – ON Semi Manufacturing Liaison to Business Unit Interface between BU and Manufacturing to introduce new platforms. Resolve issues between BU and Front-end and Back-end Manufacturing. Manage projects to resolve these issues. 11/1/2002 to 10/1/2004 – ON Semiconductor Corporate Technology Platform Manager On team to develop technology platform development process and platform manager for several technologies. Broad responsibility for platform qualification crossing many job functions. Assisting in rollout of new Technology Development and Acquisition process (enhancement of technology platform process). Responsible for initiating/coordinating pilot programs. Managed fab transfer projects in addition two of which were the transfer of Mosaic3 and Mosaic5. 11/15/2001 to 11/1/2002 – ON Semiconductor East Greenwich Fab - Program Manager EG Staff Program Manager for Bipolar Analog transfer program to offshore fab in Czech Republic. Also supported Powersense projects in EG fab. Developed strawman strategy proposal for transfer of entire portfolio of products. Drove implementation of Program Management methodology for new technology program as well as fab transfer. 4/1/2001 TO 11/1/2001 – ON Semiconductor Thyristor/Rectifier Device Engineering Manager Class Probe and Process yields improved significantly (from 77% to 91%) in a relatively short time. Managed 8 Device engineers through merger of 2 fabs and a difficult transition since they had to deal with announcement of impending fab closure. Show less

    • United States
    • Semiconductors
    • 700 & Above Employee
    • Technology Platform Program Manager
      • Nov 2002 - Oct 2004

      On team to develop technology platform development process and platform manager for several technologies. Broad responsibility for platform qualification crossing many job functions. Assisting in rollout of new Technology Development and Acquisition process (enhancement of technology platform process). Responsible for initiating/coordinating pilot programs. Managed fab transfer projects in addition two of which were the transfer of Mosaic3 and Mosaic5. On team to develop technology platform development process and platform manager for several technologies. Broad responsibility for platform qualification crossing many job functions. Assisting in rollout of new Technology Development and Acquisition process (enhancement of technology platform process). Responsible for initiating/coordinating pilot programs. Managed fab transfer projects in addition two of which were the transfer of Mosaic3 and Mosaic5.

    • Program Manager
      • Nov 2001 - Nov 2002

      EG Staff Program Manager for Bipolar Analog transfer program to offshore fab in Czech Republic. Also supported Powersense projects in EG fab. Developed strawman strategy proposal for transfer of entire portfolio of products. Drove implementation of Program Management methodology for new technology program as well as fab transfer. EG Staff Program Manager for Bipolar Analog transfer program to offshore fab in Czech Republic. Also supported Powersense projects in EG fab. Developed strawman strategy proposal for transfer of entire portfolio of products. Drove implementation of Program Management methodology for new technology program as well as fab transfer.

    • United States
    • Semiconductors
    • 700 & Above Employee
    • Engineering Manager
      • Apr 2001 - Nov 2001

      Class Probe and Process yields improved significantly (from 77% to 91%) in a relatively short time. Managed 8 Device engineers through merger of 2 fabs and a difficult transition since they had to deal with announcement of impending fab closure. Provided structure and yield enhancement methodology to Device engineers that had been perceived as unsuccessful prior to my arrival. 2/1/2000 TO 4/1/2001 – ON Semiconductor Zener/Rectifier Fab - 6” Development Programs/NPD/Program… Show more Class Probe and Process yields improved significantly (from 77% to 91%) in a relatively short time. Managed 8 Device engineers through merger of 2 fabs and a difficult transition since they had to deal with announcement of impending fab closure. Provided structure and yield enhancement methodology to Device engineers that had been perceived as unsuccessful prior to my arrival. 2/1/2000 TO 4/1/2001 – ON Semiconductor Zener/Rectifier Fab - 6” Development Programs/NPD/Program Controller Under my guidance the group developed 6” Zener processes. Task was very difficult due to cross wafer variation and 5% voltage tolerances. Developed 20,000 6” wafer/week discrete wafer fab plan along with fab layout to accommodate. Implemented plan for 6” Bipolar Power fab. Completed cost/decision model in conjunction with finance to make comparisons between different scenarios and technology mix combinations for entire discrete portfolio on one site. Supported company effort to implement PMIS Program Management system through training Project Managers etc. Rolled out Program Management/PSG process. Key new products were introduced (Nokia and others). Managed 12 engineers and 5 technicians. Note: Motorola Discrete Semiconductors became ON Semiconductor and I continued with ON Semi after the split from Motorola. 9/1/98 TO 2/1/2000 - Motorola Zener/Rectifier fab as Device Engrg/QualityEngrg Manager/New Product/Process Development Improved yields on Ultrafast Rectifier to record levels. Returned yields to a high level on discrete Power Schottky technology through group’s effort to solve chronic periodic yield issues. Reduced customer returns to record low level through real root cause identification. Improved customer return defect rate to 2 ppB. Utilized team approach including sales and customer at first report of incident. Managed 15 engineers and 6 technicians. Show less Class Probe and Process yields improved significantly (from 77% to 91%) in a relatively short time. Managed 8 Device engineers through merger of 2 fabs and a difficult transition since they had to deal with announcement of impending fab closure. Provided structure and yield enhancement methodology to Device engineers that had been perceived as unsuccessful prior to my arrival. 2/1/2000 TO 4/1/2001 – ON Semiconductor Zener/Rectifier Fab - 6” Development Programs/NPD/Program… Show more Class Probe and Process yields improved significantly (from 77% to 91%) in a relatively short time. Managed 8 Device engineers through merger of 2 fabs and a difficult transition since they had to deal with announcement of impending fab closure. Provided structure and yield enhancement methodology to Device engineers that had been perceived as unsuccessful prior to my arrival. 2/1/2000 TO 4/1/2001 – ON Semiconductor Zener/Rectifier Fab - 6” Development Programs/NPD/Program Controller Under my guidance the group developed 6” Zener processes. Task was very difficult due to cross wafer variation and 5% voltage tolerances. Developed 20,000 6” wafer/week discrete wafer fab plan along with fab layout to accommodate. Implemented plan for 6” Bipolar Power fab. Completed cost/decision model in conjunction with finance to make comparisons between different scenarios and technology mix combinations for entire discrete portfolio on one site. Supported company effort to implement PMIS Program Management system through training Project Managers etc. Rolled out Program Management/PSG process. Key new products were introduced (Nokia and others). Managed 12 engineers and 5 technicians. Note: Motorola Discrete Semiconductors became ON Semiconductor and I continued with ON Semi after the split from Motorola. 9/1/98 TO 2/1/2000 - Motorola Zener/Rectifier fab as Device Engrg/QualityEngrg Manager/New Product/Process Development Improved yields on Ultrafast Rectifier to record levels. Returned yields to a high level on discrete Power Schottky technology through group’s effort to solve chronic periodic yield issues. Reduced customer returns to record low level through real root cause identification. Improved customer return defect rate to 2 ppB. Utilized team approach including sales and customer at first report of incident. Managed 15 engineers and 6 technicians. Show less

    • Device Engineering Manager
      • Jan 1997 - Sep 1998

      Device Engineering Mgr. (OPTO and Small Signal) Scrap value added was nearly 9% for Q2 1997 and goal of 7% was exceeded before the fab was closed in late Q3 of 1998 (or 5 straight years this fab had run at almost 20%). Responsibility for all OPTO lines added. Manage all new products programs within BP5 including High Speed OPTO, low Rs tuning diode, low Vf Schottky, and SC-90 BRT’s. Tracking monthly on Joint Fab Assembly/DFM – fixed many key issues – JFET DFM redesign, TMOS PRS… Show more Device Engineering Mgr. (OPTO and Small Signal) Scrap value added was nearly 9% for Q2 1997 and goal of 7% was exceeded before the fab was closed in late Q3 of 1998 (or 5 straight years this fab had run at almost 20%). Responsibility for all OPTO lines added. Manage all new products programs within BP5 including High Speed OPTO, low Rs tuning diode, low Vf Schottky, and SC-90 BRT’s. Tracking monthly on Joint Fab Assembly/DFM – fixed many key issues – JFET DFM redesign, TMOS PRS improvement, SOT223 yield issues due to die cracking. 33% GDPW die productivity improvement qualified prior to fab shutdown/transfer. Yield enhancement team efforts continue with methodology institutionalized. Through efforts of TOP TEN teams OPTR U/P yields have gone from 90.8% to 94.9% and C/P yields from 85.4% to >97%. Managed 9 Device engineers. Q1 1996 to Q1 1997 – Motorola Small Signal Device Section Mgr. Continued improvement on U/P yields from 93% to 97% and C/P from 94.5% to beyond 97%. The scrap value added in BP5 has improved to near 9% (from 21% in 1995) driven largely by Class Probe yields. Implemented tool/system to track GDPW productivity and measure progress monthly. Is a model to look into the future and input planned shrinks and output the % improvement. This timing is tied to actual project plans on all shrunk lines. Plan to achieve 30% productivity improvement by Q2 1998 was qualified including a 34% shrink on SS TMOS. Continuous improvement progressed throughout 1996 and Q3 1997 with yield enhancements. See attachments for detail on yield improvements. Managed 5 Device engineers. Q4 1995 to Q1 1996 – Motorola Acting Small Signal Device Section Mgr. Methodology implemented to track yields vs. history at technology, wafer line and device line level tied to specific actions. Additional earlier history available upon request. Show less Device Engineering Mgr. (OPTO and Small Signal) Scrap value added was nearly 9% for Q2 1997 and goal of 7% was exceeded before the fab was closed in late Q3 of 1998 (or 5 straight years this fab had run at almost 20%). Responsibility for all OPTO lines added. Manage all new products programs within BP5 including High Speed OPTO, low Rs tuning diode, low Vf Schottky, and SC-90 BRT’s. Tracking monthly on Joint Fab Assembly/DFM – fixed many key issues – JFET DFM redesign, TMOS PRS… Show more Device Engineering Mgr. (OPTO and Small Signal) Scrap value added was nearly 9% for Q2 1997 and goal of 7% was exceeded before the fab was closed in late Q3 of 1998 (or 5 straight years this fab had run at almost 20%). Responsibility for all OPTO lines added. Manage all new products programs within BP5 including High Speed OPTO, low Rs tuning diode, low Vf Schottky, and SC-90 BRT’s. Tracking monthly on Joint Fab Assembly/DFM – fixed many key issues – JFET DFM redesign, TMOS PRS improvement, SOT223 yield issues due to die cracking. 33% GDPW die productivity improvement qualified prior to fab shutdown/transfer. Yield enhancement team efforts continue with methodology institutionalized. Through efforts of TOP TEN teams OPTR U/P yields have gone from 90.8% to 94.9% and C/P yields from 85.4% to >97%. Managed 9 Device engineers. Q1 1996 to Q1 1997 – Motorola Small Signal Device Section Mgr. Continued improvement on U/P yields from 93% to 97% and C/P from 94.5% to beyond 97%. The scrap value added in BP5 has improved to near 9% (from 21% in 1995) driven largely by Class Probe yields. Implemented tool/system to track GDPW productivity and measure progress monthly. Is a model to look into the future and input planned shrinks and output the % improvement. This timing is tied to actual project plans on all shrunk lines. Plan to achieve 30% productivity improvement by Q2 1998 was qualified including a 34% shrink on SS TMOS. Continuous improvement progressed throughout 1996 and Q3 1997 with yield enhancements. See attachments for detail on yield improvements. Managed 5 Device engineers. Q4 1995 to Q1 1996 – Motorola Acting Small Signal Device Section Mgr. Methodology implemented to track yields vs. history at technology, wafer line and device line level tied to specific actions. Additional earlier history available upon request. Show less

Education

  • U. of Phoenix
    Bachelor of Arts; Associate, Management; Arts; Engineering Technology
    1991 - 1993
  • Glendale Community College
    Associate of Arts and Sciences (AAS), Electrical, Electronic and Communications Engineering Technology/Technician

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