Experience

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• Brazil
• Business Consulting and Services
• 100 - 200 Employee
• Product Manager

  • Mar 2023 - Present


Oyla Inc

• United States
• Information Technology & Services

• Technical Product Lead

  • Jul 2022 - Jan 2023

  Technical lead for product development and customer PoCs/trialsOyla has developed the first Lidar+RGB fusion camera capable of high resolution imaging and long-range active depth sensing with perfect point-to-pixel alignment. Oyla provides 3D computer vision solutions for industrial safety, security, 3D mapping, and autonomous mobility applications.

• Senior Development Engineer

  • Jul 2020 - Jul 2022

  Developed software for camera calibration, depth processing, camera capture and visualization interfaces, and perception applications (object detection, segmentation, tracking)



Bessemer Venture Partners

• United States
• Venture Capital and Private Equity Principals
• 100 - 200 Employee

• InSITE Fellow

  • Jan 2020 - Mar 2020

  Developed investment thesis and identified compelling early-stage companies in industrial automation/IoT. Developed investment thesis and identified compelling early-stage companies in industrial automation/IoT.



Stanford Technology Ventures Program (STVP)

• Threshold Ventures (formerly DFJ) Fellow

  • Jan 2019 - Jun 2019

  One of twelve Stanford Engineering masters students selected for fellowship program focused on venture creation and entrepreneurship. One of twelve Stanford Engineering masters students selected for fellowship program focused on venture creation and entrepreneurship.



Adesto Technologies

• United States
• Semiconductor Manufacturing
• 1 - 100 Employee

• Product Management Advisor

  • Sep 2018 - Dec 2018

  Assessed new product opportunity for Echelon's embedded IoT platform in the energy sector (market analysis, PMF, go-to-market). Assessed new product opportunity for Echelon's embedded IoT platform in the energy sector (market analysis, PMF, go-to-market).



Cavium Inc

• United States
• Semiconductor Manufacturing
• 100 - 200 Employee

• RTL Design Engineer Intern

  • May 2018 - Aug 2018

  Implemented new designs and power reduction techniques in next-generation Octeon chips. Implemented new designs and power reduction techniques in next-generation Octeon chips.



Intel Corporation

• United States
• Semiconductor Manufacturing
• 700 & Above Employee

• Pre-Silicon Validation Engineer Co-op

  • May 2017 - Jul 2017

  Validated design-for-test features in high-performance server chips for post-fabrication defect detection. Validated design-for-test features in high-performance server chips for post-fabrication defect detection.