Experience

SUMCO

• Semiconductor Manufacturing
• 300 - 400 Employee

• Staff Engineer + OS Lab Supervisor

  • Oct 2009 - Present

  Supervisor of the manufacturing supporting OS Evaluations Lab.The OS Lab is evaluating all the customer products manufactured onsite: from freshly grown CZ ingot slug samples to finished Mirror Polished Product wafers using thermal treatments, µ-PCD, DSPV, FTIR, Etching, optical Microscope inspection and other evaluation techniques. Supervising 3 technicians. In charge of overseeing the day-to-day operations of the Lab, development and implementation of operational improvements, training and documentation. Show less

• Staff Engineer

  • Jul 2008 - Present

  Technology Center - in charge of the Thermal Treatment and Physical Evaluation Area. Responsibilities include maintaining and developing thermal treatments for various silicon and solar product quality evaluations (Bulk Iron, Bulk Lifetime, Bulk Micro Defects, Oxygen Precipitates, etc.), executing Failure Analysis Requests for internal and external customers by applying µ-PCD Lifetime, (digital) Surface Photo Voltage (DSPV) Bulk Iron concentration, FTIR Oxygen concentration, and Film Thickness measurement techniques; performing weekly and monthly Production tool baseline monitoring using µ-PCD and DSPV, maintaining and troubleshooting the various analysis tools and processing equipment. Show less



IM Flash

• United States
• Semiconductors
• 400 - 500 Employee

• Process Owner TEOS - Diffusion

  • Apr 2006 - Nov 2007

  I was the process owner of the vertical diffusion TEOS furnaces at IM Flash responsible for the timely qualification and start-up of those furnaces. Troubleshooting, process control, training and day-to-day operations. I was the process owner of the vertical diffusion TEOS furnaces at IM Flash responsible for the timely qualification and start-up of those furnaces. Troubleshooting, process control, training and day-to-day operations.



Intel Corporation

• United States
• Semiconductor Manufacturing
• 700 & Above Employee

• Process Engineer - Diffusion

  • Jul 2000 - Nov 2007

  positions in equipment and process engineering in the Diffusion area, 200mm and 300mm wafer manufacturing; temp. assignment with IM Flash Technologies (Intel-Micron joint venture) positions in equipment and process engineering in the Diffusion area, 200mm and 300mm wafer manufacturing; temp. assignment with IM Flash Technologies (Intel-Micron joint venture)



Tokyo Electron US

• Japan
• Semiconductor Manufacturing
• 700 & Above Employee

• Technical Support Process Engineer - Diffusion Systems

  • Jan 1997 - Jul 2000

  Phone and on-site customer support, troubleshooting, installation and qualification support at start-ups for TEL vertical diffusion furnace. Phone and on-site customer support, troubleshooting, installation and qualification support at start-ups for TEL vertical diffusion furnace.



Silicon Valley Group

• Semiconductor Manufacturing
• 1 - 100 Employee

• Field Process Engineer - Diffusion

  • Nov 1994 - Oct 1996