Dinesh Raja P

Radio Frequency Design Engineer at FLDEC SYSTEMS
  • Claim this Profile
Contact Information
us****@****om
(386) 825-5501
Location
Chennai, Tamil Nadu, India, IN
Languages
  • English Professional working proficiency
  • Tamil Native or bilingual proficiency
  • Hindi Elementary proficiency

Topline Score

Topline score feature will be out soon.

Bio

Generated by
Topline AI

5.0

/5.0
/ Based on 1 ratings
  • (1)
  • (0)
  • (0)
  • (0)
  • (0)

Filter reviews by:

Arpit singh

Innovative and visionary. Strong technical and problem solving skills. Good team player. Quick starter and self-learner. Quick learner and hardworking.

You need to have a working account to view this content.
You need to have a working account to view this content.

Credentials

  • Trinity College London: Awarded B1.2 With Merit
    -
    Jun, 2010
    - Nov, 2024

Experience

    • India
    • Research Services
    • 100 - 200 Employee
    • Radio Frequency Design Engineer
      • Mar 2022 - Present

    • RF design engineer
      • Nov 2017 - Mar 2022

  • TECHSO TECHNOLOGIES
    • Chennai Area, India
    • RF Design/Antenna/ Microwave Engineer
      • Dec 2016 - Dec 2017

      RF and Antenna Design AMC/FSS Signal Integrity Power Integrity PCB design Microwave engineering EBG High Speed Circuits EMI/EMC Spectrum Analyzer Crosstalk Network Analyzer RF and Antenna Design AMC/FSS Signal Integrity Power Integrity PCB design Microwave engineering EBG High Speed Circuits EMI/EMC Spectrum Analyzer Crosstalk Network Analyzer

  • RMKCET
    • Chennai Area, India
    • JRF
      • Sep 2015 - Dec 2016

      Worked in ISRO Funded project , Space Application Centre (SAC) at Ahmedabad Video processing in FPGA Knowledge in Digital Design Worked in ISRO Funded project , Space Application Centre (SAC) at Ahmedabad Video processing in FPGA Knowledge in Digital Design

    • Education Administration Programs
    • 500 - 600 Employee
    • UWB SUPRESSION OF GROUND BOUNCE NOISE USING UNIPLANAR COMPACT-EBG WITH MEANDERED MODIFIED BRIDGE
      • Jun 2013 - Nov 2013

      In current scenario,Packaging technologies such as voice,Memory device,RF/analog ,video etc and all Integrated in single package we called as system on package(sop).while doing a PCB(printed circuit board) design, noise will occurred from Digital circuits.this noise is disturbed RF performance.EBG( Electro magnetic bandgap) is one of the most promising Technology to Eliminate Noise In current scenario,Packaging technologies such as voice,Memory device,RF/analog ,video etc and all Integrated in single package we called as system on package(sop).while doing a PCB(printed circuit board) design, noise will occurred from Digital circuits.this noise is disturbed RF performance.EBG( Electro magnetic bandgap) is one of the most promising Technology to Eliminate Noise

Education

  • Thiyagarajar college of engineering
    Master's Degree, Communication systems
    2012 - 2014
  • RMKCET
    Bachelor's Degree, Electrical, Electronics and Communications Engineering
    2008 - 2012
  • LEO MATRIC HR SEC SCHOOL
    High School, Mathematics,physics, chemistry
    2006 - 2008

Community

You need to have a working account to view this content. Click here to join now