Dinesh Raja P
Radio Frequency Design Engineer at FLDEC SYSTEMS- Claim this Profile
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English Professional working proficiency
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Tamil Native or bilingual proficiency
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Hindi Elementary proficiency
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Bio
Arpit singh
Innovative and visionary. Strong technical and problem solving skills. Good team player. Quick starter and self-learner. Quick learner and hardworking.
Arpit singh
Innovative and visionary. Strong technical and problem solving skills. Good team player. Quick starter and self-learner. Quick learner and hardworking.
Arpit singh
Innovative and visionary. Strong technical and problem solving skills. Good team player. Quick starter and self-learner. Quick learner and hardworking.
Arpit singh
Innovative and visionary. Strong technical and problem solving skills. Good team player. Quick starter and self-learner. Quick learner and hardworking.
Credentials
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Trinity College London: Awarded B1.2 With Merit
-Jun, 2010- Nov, 2024
Experience
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FLDEC SYSTEMS
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India
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Research Services
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100 - 200 Employee
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Radio Frequency Design Engineer
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Mar 2022 - Present
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BRYKA ELECTROSYSTEMS AND SOFTWARE PRIVATE LIMITED
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India
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1 - 100 Employee
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RF design engineer
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Nov 2017 - Mar 2022
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TECHSO TECHNOLOGIES
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Chennai Area, India
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RF Design/Antenna/ Microwave Engineer
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Dec 2016 - Dec 2017
RF and Antenna Design AMC/FSS Signal Integrity Power Integrity PCB design Microwave engineering EBG High Speed Circuits EMI/EMC Spectrum Analyzer Crosstalk Network Analyzer RF and Antenna Design AMC/FSS Signal Integrity Power Integrity PCB design Microwave engineering EBG High Speed Circuits EMI/EMC Spectrum Analyzer Crosstalk Network Analyzer
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RMKCET
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Chennai Area, India
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JRF
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Sep 2015 - Dec 2016
Worked in ISRO Funded project , Space Application Centre (SAC) at Ahmedabad Video processing in FPGA Knowledge in Digital Design Worked in ISRO Funded project , Space Application Centre (SAC) at Ahmedabad Video processing in FPGA Knowledge in Digital Design
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Thiagarajar College of Engineering
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Education Administration Programs
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500 - 600 Employee
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UWB SUPRESSION OF GROUND BOUNCE NOISE USING UNIPLANAR COMPACT-EBG WITH MEANDERED MODIFIED BRIDGE
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Jun 2013 - Nov 2013
In current scenario,Packaging technologies such as voice,Memory device,RF/analog ,video etc and all Integrated in single package we called as system on package(sop).while doing a PCB(printed circuit board) design, noise will occurred from Digital circuits.this noise is disturbed RF performance.EBG( Electro magnetic bandgap) is one of the most promising Technology to Eliminate Noise In current scenario,Packaging technologies such as voice,Memory device,RF/analog ,video etc and all Integrated in single package we called as system on package(sop).while doing a PCB(printed circuit board) design, noise will occurred from Digital circuits.this noise is disturbed RF performance.EBG( Electro magnetic bandgap) is one of the most promising Technology to Eliminate Noise
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Education
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Thiyagarajar college of engineering
Master's Degree, Communication systems -
RMKCET
Bachelor's Degree, Electrical, Electronics and Communications Engineering -
LEO MATRIC HR SEC SCHOOL
High School, Mathematics,physics, chemistry