Engineering Manager II, Electrical

• Dec 2022 - Present

Engineering Manager, Electrical

• Jan 2021 - Dec 2022

Staff Engineer, Electrical Engineering

• Jan 2020 - Jun 2021

Lead Electrical Engineer : Katalyst Manager, leader : Electromechanical integration, BOMs, EMI/EMC, CE, TUV certifications, Troubleshooting and field support Technology Leader : EtherCAT, illumination & heating control, Robotic system design, cable harness designs

Senior Engineer , Electrical Engineering

• Oct 2015 - Jan 2020

Lead Engineer for Next-Gen-Platform Die Bonder.Development lead on EtherCAT communication system, Strobe illumination control and Electronics system Architecture.Leaded, Electrical Engineering development efforts for Chip to Wafer (C2W) bonders in following areas.1. Thermo-compression Bonding (TCB)2. Fan Out Wafer Level Packaging (FOWLP)

Advanced Engineer , Electrical Engineering

• Aug 2013 - Sep 2015

Development EngineeringModeling motion control system with dc brushless servos using Matlab. Compensating dc servo systems to achieve system performance.Writing routines in C or C++ language for embedded controls. Designing digital electronics such as DSP, FPGA’s, Microcontrollers, I2C, SPI and Flash. Designing analog electronics for processing analog signals including OP Amps, A/Ds, and DACs. Designing power electronics such as DC/AC converters and motor drivers.

Electrical Engineer

• Jul 2010 - Jul 2013

Responsible for Product development, PCB design and debug for pressure sensor application Application Prototyping (Microcontrollers & FPGAs) - Developed 32x32 matrix (1024 sensors) tactile pressure sensor for high temperature surface pressure mapping application in different sizes. Designed analog multiplexer, 12-bit ADC, analog buffer and comparator circuits. Wrote USB device driver, Interfaced ADCs, micro controller chips to FPGA with parallel, SPI, I2C communication protocol. - Wrote FPGA interface to tactile pressure sensor matrix, applied digital filters to acquired data and came up with sensor calibration routine on an EEPROM controlled by PIC micro controller. - Performed schematic capture and layout for data collection PCB - Designed the 1-inch x 1-inch tactile sensor with 256 sensing points. The design was done on rigid flex PCB. Successfully test the sensor to 300F. - Experience with productizing single point sensors on a hand-held meter with LCD display. - Successfully designed and implemented voltage regulator, Ni-MH / Ni-Cd battery charging circuitry. Worked on various Pressure Sensor (MEMS, piezo-resistive, Capacitive Touch) - Studied output response of various pressure sensors. - Able to convert sensor’s response into measurable electrical signal. - Experience with signal conditioning and noise filtering.

ASIC Test Engineer

• Jan 2010 - Jun 2010

Hands on experience with Oscilloscopes, Logic Analyzer, Spectrum Analyzer, DSO, high quality DMMs, power supplies, temperature chambers, Credence tools. Tested Iwatt ASIC products: iw1692, iw1696, iw1697, iw3610 Tested ASICs in temperature chambers for its performance over the range -25°C to 125°C Hands on experience with Oscilloscopes, Logic Analyzer, Spectrum Analyzer, DSO, high quality DMMs, power supplies, temperature chambers, Credence tools. Tested Iwatt ASIC products: iw1692, iw1696, iw1697, iw3610 Tested ASICs in temperature chambers for its performance over the range -25°C to 125°C

R & D engineer (ASIC group)

• Apr 2008 - Dec 2009

Worked on designing Beta Multiplier (40μA), bandgap voltage reference (100ppm/°C), switch capacitor circuit, sample & hold amplifier and pipelined ADC using HSPICE & Avanwaves environment. Worked on AC, DC, Transient, Sensitivity, Fourier, Transfer Function, Monte-Carlo analyses and simulations as well as Proficient with Feasibility analysis using MATLAB modeling & transformation of MATLAB parameters into circuit elements. Worked on testing of PLL, SAR ADC, Charge Amplifier, Bandgap Reference Circuit, Programmable Gain Amplifier, I to V amplifier, Delta-Sigma ADC, Differential Drive and Start-up Drive amplifiers, Worked on tests over temperature in environmental chambers