Deshi Lim
Member of Technical Staff Product Verification Engineer at Altera- Claim this Profile
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Bio
Experience
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Altera
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United States
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Semiconductors
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700 & Above Employee
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Member of Technical Staff Product Verification Engineer
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Mar 2010 - Present
- Technical lead for the IC characterization, validation and verification of new leading edge FPGA devices’ “High Speed External Memory Interfaces” including following responsibilities: o Develop new device verification & characterization strategies, plans and schedules by integrating different requirements from various engineering and business departments o PCB board requirements integration & design participation o Proficient in Verilog design creation & ModelSim simulation verification o Supervised and performed both modular & system level measurements for External Memory Interfaces (DDR3/4, LPDDR2, PLL, GPIO & etc.) using state-of-the-art characterization equipment (high bandwidth oscilloscopes, high frequency pulse/signal generators, programmable power supplies, logic analyzer/protocol analyzer, digital multimeters..) o Automated measurement using high performance ATE tester (Advantest Verigy V93k tester) o Analyzed measurement results to ensure meeting spec requirements (e.g JEDEC or Altera design target) else worked with design team for issue resolution o Support customer issues with regard to Critical Memory Interfaces failures, driving team effort for failure analysis, root cause investigation and finalizing the verification and implementation of workable solution. Show less
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Radisys Corporation
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United States
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Telecommunications
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700 & Above Employee
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Advance Hardware Engineer
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Jan 2008 - Feb 2010
- In charge of board spin overall hardware validation and specific functional tests. - Utilized high bandwidth oscilloscope/probes in a test fixture with built in test software for high speed bus signal integrity measurements (FSB, 100M/1G Ethernet, PCI-E, USB, DDR2 connection) - Utilized low bandwidth oscilloscope & probes for power/voltage, current, clock & low speed signal integrity measurements (I2C & RS232 serial bus) - Ran 4 corner thermal/voltage stress tests using programmable thermal chamber. Show less
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Intel Corporation
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United States
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Semiconductor Manufacturing
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700 & Above Employee
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Revenue Product Engineer
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Mar 2006 - Dec 2007
- Product ownership for ATCA server board with Intel Architecture from NPI phase till product end of life - Worked with cross-functional teams from different sites to ensure smooth production while maintaining product quality & reliability - Qualified new components on board to replace end of life components or components with design quality/reliability issues - Provided customer support for debugging reported field failures using structured problem solving process, schematic & layout reviews plus lab measurements to determine the root cause of failure - Coordinated/participated in daily work meetings to drive resolution for a host of product issues varying from board design to component quality and manufacturing process. - Executed ECO (engineering change order) process whenever there was a need for engineering change in the BOM (bill of material) Show less
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G-Tek Electronics
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Appliances, Electrical, and Electronics Manufacturing
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1 - 100 Employee
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R & D Hardware Engineer
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May 2005 - Feb 2006
- Member of Telecommunication products development team o Bluetooth Gateway, WIFI/VOIP hand phone - Schematic design using Protel and Orcad software - Sourced for new components - Prepared product introduction documents including BOM, schematic, product test procedure, block diagram and etc. - Electronics troubleshoot and debug, hands-on PCB rework. - Evaluated the performance and identified the problems of developing product from user point of view. - Member of Telecommunication products development team o Bluetooth Gateway, WIFI/VOIP hand phone - Schematic design using Protel and Orcad software - Sourced for new components - Prepared product introduction documents including BOM, schematic, product test procedure, block diagram and etc. - Electronics troubleshoot and debug, hands-on PCB rework. - Evaluated the performance and identified the problems of developing product from user point of view.
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Education
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Multimedia University
B Eng (Hons) Electronics Engineering, Electronics and Telecommunication Engineering -
Multimedia University
B Eng (Hons) Electronics Engineering, Electronics majoring in telecommunications